Thursday, January 3, 2019

Innovation and IP filing in Atomic Layer Deposition has moved from Memory to Logic

By studying the filing of IP world wide one can clearly see the trend how innovation in Atomic Layer Deposition (ALD) has moved from Memory to Logic. During the introduction of ALD (2003 to 2006) in high volume manufacturing of DRAM on 300 mm wafers most IP was filed by Samsung, Micron and SK Hynix. 10 years later (2013-2018) the IP filing lead has been taken over by Logic MPU manufacturers TSMC, Intel and Globalfoundries.

The patent application assignee from the past 25 years.