Showing posts with label ALD materials. Show all posts
Showing posts with label ALD materials. Show all posts

Sunday, December 4, 2016

Save The Date - 2nd Annual Critical Materials Conference May 11-12, 2017, in Dallas Texas

Save the Date for our 2nd Annual Critical Materials Conference in Dallas, Texas. Please visit our Seminars page to view the highlights from 2016. Call for Papers Starts Nov. 15.



  • Event Start Date: May 11, 2017
  • Event End Date:May 12, 2017
  • Event Venue: Dallas, Texas, USA

The Critical Materials Council is a membership-based organization collectively working toward anticipating, and solving Critical Materials Issues in a non-competitive environment by identifying/alleviating supply problems, sharing best practices, and working on industry standards for the benefit of the semi device fabrication community.

 

 Become a part of the Critical Materials Ecosystem!

  • Unique Networking and Active Collaboration Opportunities
  • Gain access to the latest customized supply chain news and analyst commentary
  • Receive an expertly-written Critical Materials Report Advisory of your choosing

Tuesday, June 21, 2016

IMI Labs formed to accelerate chip materials selection

As reported by EE Times: Intermolecular Inc. (San Jose, Calif.) has divided its business into two halves; IMI Discovery, which licenses out intellectual property, and IMI Labs, which provides a service based business to find material systems.

 
IMI Labs, which has a 300mm wafer fab in San Jose, makes use of Intermolecular’s high-throughput experimentation platform, materials expertise and analytics to speed exploration, discovery, characterization and selection of advanced materials.

The use of atomic layer deposition and physical vapor deposition and up to hundreds of experiments on a each wafer means that IMI Labs can optimize and bring up material systems rapidly. Bruce McWilliams, who took over as CEO of Intermolecular in October 2014, pointed out that while 300mm wafer fabs are plentiful in industry they are devoted to mass production and not usually available to run experimental wafers. 
 
Full story here in EE Times by Petter Clarke "IMI Labs formed to accelerate chip materials selection"
 
 
IMI ALD 300 mm process chamber with four separate ALD processes can be performed in different regions of the same substrate, simultaneously enabling faster ALD process development [intermolecular.com]
 

ALD Technology at Intermolecular

"IMI can deliver results that require materials control at the atomic scale. Atomic Layer Deposition (ALD) is one of the tools used extensively to engineer materials and devices at this elemental level. IMI adds the speed and flexibility of high-throughput processing to ALD with its site-isolated, quad combi ALD reactor technology. Four separate ALD processes can be performed in different regions of the same substrate, simultaneously enabling faster ALD process development and device evaluations."

 
IMI High-Throughput Experimentation uses state-of-the art deposition equipment and thin film metrology to meet the materials needs of our customers in semiconductors, displays, glass and coatings and other industries. PVD and ALD methods are primarily used to perform the experiments needed to rapidly analyze materials. Multiple PVD and ALD equipment can be combined for in-situ development and annealing enabling deposition to be carried without vacuum break. Example: Configuration including two PVD chambers and two ALD chambers and in-situ anneal. [intermolecular.com]

ALD Materials at Intermolecular

IMI has built extensive capabilities to process a wide variety of periodic table elements  and material systems using its PVD and ALD equipment. Complex multinary material systems can be deposited in a controlled environment. here you can find further information : http://intermolecular.com/materials/




Thursday, May 5, 2016

Photo show from The CMC Conference - a Great Success!

Here is an ongoing blog on reporting on the CMC Conference in Hillsboro 5-6th of May. For those of you who attended - Thank you for attending the Critical Materials Conference! It was an overwhelming success! Attendees comments thus far include: "fantastic event", "really appreciated", "great value", with "High quality speakers and attendees"! We want to hear more! 

"It was one of the best conferences that I have ever attended."

More information will be added during the coming week and if you have any nice pictures from the event please send them to me. Also stay tuned for the announcement from the CMC Panel that will be published soon by CMC Conference Co-Chair Ed Korczynski

For attendees still in need of access, please email us
Don't forget to Plan for CMC Conference 2017
May 4, 2017, Dallas, TX (tentative) 
The Critical Materials Conference is a 2 day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Business drives the world, but technology enables semiconductor business, so we must understand the dynamics of how materials and technologies enable the scaling of devices in IC fabs. Conference speakers will provide information on critical materials used in HVM fabs, while also looking at manufacturing integration issues associated with new materials needed for future devices. Notable speakers from leading semiconductor fabricators, and materials companies, and leading market research firms will provide insights on this ever changing area of semiconductor process materials and markets.



I met the first time for real with Angel Yanguas-Gil, a staff scientist at Argonne National Laboratory‘s Energy Systems Division and also an Institute Fellow at the Northwestern Argonne Institute of Science and Engineering (NAISE) at Northwestern University. Angel took a very active part in the sessions Q&A with insightful questions to the ALD Industry. Check out his web here for some more information and cool stuff.


The CMC Conference was held at the Embassy Suites by Hilton Portland Hillsboro, Oregon, USA 5-6th of May.


Posing with my ALD2016 Ireland polo shirt.



Hiromichi Enami form Hitachi High-Tech and CMC Co-Chair Ed Korczynski discussing critical challenges in the semoconductor materials supply chain at the round table discussions.



Rasirc sponsoring and presenting "Hydrazine as a Low Temperature Nitride Source: Materials Challenges for High Volume Manufacturing " at the event posing Dan Alvarez CTO and Jeff Spiegelman President and Founder.



 Two of the speakers, Dr. S.I. Lee (CTO Veeco) presenting "Low Temp Spatial ALD for Multiple Patterning Materials " and Dr. Jean Marc Girard (CTO Air Liquide) presenting "ALD Precursor Development Challenges for HVM" as well as being part of the conference committee. There will be an opportunity to meet both gentlemen ALD 2016 in Dublin. 




Part of Team ZyALD(TM): Ravi Laxman (Linde), Jonas Sundqvist, Ashotosh Misra (Air Liquide) and Jean Marc Girard (Air Liquide).


All set for giving my talk on ALD/CVD Precursor & Equipment Market Trends. Please contact me if you would like to have a copy of the presentation. (Picture by Angel)


The Round Table and Beer Tasting event organized by Alan Balderson (Kanto Chemical) and sponsored by Hitachi High-Tech was very successful and here is the collection of local beers that were part of the tasting.



Day 2 ended with The CMC Conference Panel moderated by Ed Korczyinski (Techcet/Solid State Technology) : John Smythe (Micron), Jonas Sundqvist (Techcet/Fraunhofer IKTS), Jeff Hemphill (Intel), Jean Marc Girard (Air Liquide)



Monday, April 4, 2016

New Critical Materials Conference's Powerful Agenda



 Buy Reports  | CMC Fabs   |  CMC Conference  |  Register Now
New Critical Materials Conference's Powerful Agenda
May 5-6, Hillsboro Oregon
The Critical Materials Conference provides a framework to catalyze the flow of "actionable" technical and supply chain information related to critical materials. 

New Additions to the Critical Materials Conference Include: 
  • David Thompson, Ph.D., Director of Process Chemistry of Applied Materials
    • Agony in New Material Introductions - Minimizing and Correlating Variabilities
  • Suresh Ramalingam, Sr. Director, Advanced Packaging Development of Xilinx
    • Packaging Materials - Future Challenges 
A highly differentiated program, with networking opportunities for all attendees. 
For full agenda details click here.

Themes of the Conference are centered around the needs of the Critical Materials Council and the global IC fabrication industry. While executive conferences typically focus on the "what" and "why" of materials technologies, this conference will discuss "how" new materials can be controllably, safely, and cost-effectively used in fabs. The Conference will also include market data to validate "when" materials will be needed. Attendees from fabs, OEMs, and materials suppliers alike will have the opportunity to interact with the presenters and colleagues, to gain insights into best-practices of the entire supply-chain.
 
For more information on the conference go to www.cmcfabs.org/seminars/ 
Great Sponsorship Opportunities available, 
please contact cmcinfo@techcet.com or call 1-480-382-8336

Sponsors and Committee

Sunday, April 3, 2016

Atomic Layer Deposition at The CMC Conference, 5-6 May, Hillsboro, OR

For those of you that have a chance to attend the CMC Conference coming up in Hilsboro, 5-6th of May here is an updated List of Speakers. We are very happy to announce three key persons in from the ALD industry giving invited talks at this two day event  : 
  • Jean-Marc Girard from Air Liquide
  • S.I. Lee from Veeco
  • David Thompson from Applied Materials

In addtion, a number of invited talks related to ALD by Industry Leaders & Experts:
  • Rob Nine, Strategic Marketing - Pall Microelectronics 
  • Jeff. Hemphill, Sr. Materials Engineer - Intel Corp.
  • John Smythe, Ph.D., Advanced Technology Lead DMTS - MICRON Technologies
  • Max Kelman, Ph.D., Sr. Technology Manager – Aixtron 
  • Dan Alvarez, Ph.D., Chief Technical Officer - RASIRC
Check the schedule below for more details or go directly to the CMC Conference page here: http://cmcfabs.org/seminars/

Day 1, Session II:

Immediate Challenges of Materials & Manufacturing



Day 2, Session III, 1/2 Day:

Emerging Materials Challenges

Wednesday, November 4, 2015

Warm welcome to VaporPulse Technologies one of our new sponors!

A warm welcome to VaporPulse Technologies and Founder and Presiden Christopher Oldham - one of the new sponsors of the BALD Engeneering ALD News Blog! You will hear much more about VaporPulse and their ALD technology in the near future. Until then please do not hesitate to visit their web page : http://www.vaporpulse.com/


 
"VaporPulse we have commercialized a proprietary technology for improving materials used in everyday applications through our nanoscale coatings. The nanoscale coatings are delivered through a novel low temperature, solvent free process that offers extraordinary performance on well known but hard to process materials. VaporPulse’s coatings are highly functional and can be applied on a range of materials from paper to plastics to metals. Our coatings are conformal and uniform whether the part is flat or complex in shape, dense or porous, and the coatings can be applied on features down to the nano-scale."

"In 2010 VaporPulse Technologies, Inc. was launched out of NC State University. The VaporPulse technology is based on over ten years of research in the College of Engineering at NC State University and one year of business development in the Technology Entrepreneurship and Commercialization (TEC) program in the Poole College of Management at NC State University. "