Monday, November 17, 2014

Ultra-compact capacitors by ALD for the electronics market

Fraunhofer IPMS-CNT and IZM-ASSID presented ultra-thin and integrated capacitors with a high capacity and specially tailored features for industrial applications at electronica, the international trade show for components, systems and applications in the electronic sector in Munich (November 11-14, 2014).
 
 
New High Density capacitors for SiP From Fraunhofer institutes IPMS & IZM ASSID Booth A4.113 (Twitter: https://twitter.com/IZMASSID
 
The division "Center Nanoelectronic Technologies" (CNT) is the Fraunhofer IPMS research and development platform for material and process optimization for the industrial semiconductor production. Together with Fraunhofer IZM-ASSID and ALD Lab Dresden, a competence center for atomic layer deposition, the CNT developed an ultra-compact capacitor for direct integrated circuit packaging. The capacitor’s design and features can be adapted to specific customer requirements and a large range of capacity values can be achieved with the use of high-k materials and special structuring processes.

 
 
Close up of the Ultra Thin High Density capacitors for SiP From Fraunhofer institutes IPMS & IZM ASSID Booth A4.113 (Twitter: https://twitter.com/IZMASSID
 
Customizable high density integrated capacitors.
 
Besides the direct integration (“system in package”), the capacitor is also suited for implementation in high-end printed circuit boards. In addition, the technology is also used in interposers or directly on the chip metallization level. The application fields of these capacitors vary and may include signal filtering in low- and high-frequency applications, for decoupling purposes and as energy storage.