ALD for Light Emitting LED and OLED by Picosun

From AZ Materials: Over the past few years, the wafer-based semiconductor industry has been using the atomic layer deposition (ALD) thin film coating technique to develop a wide range of electronic products and components. For an improved level of system miniaturization and integration, thin films have to be uniform, dense and conformal, as well as free from pinholes, cracks and other defects.

When the preferred film thickness begins to approach nanometer scale, traditional thin film deposition methods such as PVD and CVD do not meet this requirement. In contrast, ALD forms excellent quality films even on the most complex nanoscale geometries. This can be attributed to its surface controlled and self-saturating film growth mechanism.

LED manufacturing is a wafer-based technology – similar to integrated circuit (IC) device manufacturing techniques. ALD is an optimal method that can be incorporated into current LED manufacturing processes and it can provide a wide range of benefits to the industry, either by introducing new manufacturing steps or replacing existing ones to extend the product lifetime, improve the device efficiency, or to save manufacturing costs.

Picosun’s PICOPLATFORM™ 200 vacuum cluster system for wafers up to 200mm diameter.

Currently a number of LED manufacturers across the globe are using Picosun’s ALD technology in their production. For OLEDs, Picosun delivers excellent ALD solutions to protect the devices against moisture

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