Tuesday, February 8, 2022

Samsung Electronics Is Pushing Hard to Bring Monolithic 3D DRAM to HVM by 2025

Samsung Electronics has been enjoying its DRAM market leader position for about 30 years now. To retain the position further, it has intensified its R&D of monolithic 3D DRAMs to bring them to HVM by 2025.




DRAM’s performance boost based on scaling the cell size or pitch is approaching a physical limit for cramming more cells in a limited space. Additionally, the ultra-high aspect ratio capacitors may collapse leading to compromised device reliability. Therefore, switching from current 2D DRAMs to next-generation monolithic 3D DRAMs seems inevitable.

Samsung has reportedly intensified its R&D on stacking DRAM cells on top of each other in a monolithic fashion, unlike in the case of high-bandwidth memory (HBM), wherein multiple dies are stacked atop each other.

Besides High-k/Metal Gate transistor technology, Samsung is also considering adopting FinFET or gate-all-around (GAA) technology for the DRAM cell transistor to attain better electrostatic control of the charge flow within the channel with the gate electrode.

Micron Technology and SK Hynix are also reportedly developing monolithic 3D DRAMs. Micron recently filed a patent for a monolithic 3D DRAM that is different from that of Samsung. Micron’s approach is to change the shapes of the transistor and capacitor without laying down a cell. Major equipment manufacturers such as Applied Materials and Lam Research are also developing solutions for the monolithic 3D DRAMs.

By Abhishek Kumar Thakur & Jonas Sundqvist

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