Call for Abstracts - AVS ALD 2019 and ALE 2019!

Call for Abstracts Deadline February 15, 2019

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). As in past conferences, the meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Key Deadlines: Abstract Submission Deadline: February 15, 2019 Author Acceptance Notifications: April 8, 2019 Early Registration Deadline: June 1, 2019 Hotel Reservation Deadline: June 27, 2019 JVST Special Issue Deadline: November 1, 2019

Review Topics & Submit Abstract

ALD/ALE 2019 Website

ALD Program Chairs Program Chair: Sumit Agarwal (Colorado School of Mines, USA) Program Co-Chair: Dennis Hausmann (Lam Research, USA)

ALE Program Chairs Program Chair: Craig Huffman (Micron, USA) Program Co-Chair: Gottlieb Oehrlein (University of Maryland, USA)