NCD supplied ALE and ASD equipment to Samsung Electronics Co., Ltd.

NCD has recently supplied ASD (Area Selective Deposition) equipment to Samsung Electronics Co., Ltd. Following ALE (Atomic Layer Etching).

This is the cluster system which consists of two process modules (PMs) and a wafer transfer module (TM) and applies a running program for process integration. In addition, it is equipped to process at high temperatures up to 500℃ and process with ozone and plasma for developing the next semiconductor devices.

ALE is able to etch a deposited layer by atomic scale as opposed to ALD and ASD can only deposit on the selective area not grow the whole area of substrates by ALD.

Today, lots of universities, institutes, and companies have actively been developing future high-tech and highly integrated devices using ALE and ASD processes.

NCD expects that the ALE/ASD system will contribute very much to the development of high-end semiconductor technology and is going to do all of the efforts to the best ALD equipment company with new challenges and continuous R&D.

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