Tuesday, February 14, 2017

Fraunhofer IVV improves barrier technology using atomic layer deposition

The Fraunhofer Institute for Process Engineering and Packaging IVV together with the Fraunhofer Institute for Applied Polymer Research IAP and the Fraunhofer Institute for Interfacial Engineering and Biotechnology IGB will present new developments in films and the efficient control of coating processes at the upcoming International Converting Exhibition Europe ICE being held in Munich from 21 - 23 March 2017. Under the motto "Functional films – efficient coating processes", emphasis will be put on new film functionalities and accelerated test methods (Hall A5, Stand 1031). 



The Fraunhofer IVV has acquired a new coating plant which utilizes atomic layer deposition to further reduce the permeability of films. Minimizing the permeability to water vapor and oxygen is the key to successful further improvement of high barrier films. Atomic layer deposition (ALD) is paving the way here. Coating via roll-to-roll processes allows high processing speeds and production efficiency to be achieved. Up until now, films with the highest barriers have been produced exclusively in vacuum processes. The new ALD plant at the Fraunhofer IVV enables the barrier properties of films to be significantly improved. This is a further step towards meeting the permeability requirements for OLED encapsulation in the medium term. The Fraunhofer IVV is using this technology for publicly funded R&D projects and to provide industry with customized solutions and research services for the development of processes and materials. 




Press release: LINK

Background: Fraunhofer IVV develops ultra barrier films using atomic layer deposition