Saturday, May 21, 2016

Presentations from NCCAVS Meeting on Advanced Memory availaable for Download



Recently (April 21, 2016) The North California Chapter of The American Vacuum Society (NCCAVS) Thin Film User Group organized a meeting on Advanced Memory in San Jose, California. Now all the presentations by Intel, Globalfoundries and Avalanche Technology are now available for download at the TFUG Proceedings page

The Thin Film Users Group (TFUG) focuses on state-of-art thin-films deposition and applications for semiconductor and related fields, such as nanotechnology, renewable energy, imaging devices, design for manufacturing, and advanced memory research. It is composed of engineers and scientists from device manufactures, semiconductor equipment venders and universities. The TFUG's main activity is a bi-monthly half-day open seminar from researchers and industry technologists with technical presentations on topics of current interests.
 
This event was chaired by Chakku Gopalan (Intel Corporation), Co-chared by Chari Perera (Applied Materials Deposition Products Group), Paul Werbaneth (Intevac, Inc.) and Michael Oye (UCSC).

NAND Flash: Where are we, where are we going?

Pranav Kalavade, Principle Engineer at Intel, Non-volatile Memory Solutions Group, Santa Clara.

NAND Flash: Where are we, where are we going? (471k pdf)

Emerging Memory: From Technology to Applications

Dave Eggleston, Vice President of Embedded Memory at GLOBALFOUNDRIES

Emerging Memory: From Technology to Applications (3.5MB pdf)


STT MRAM Technology and Productization

Jing Zhang, Ph.D., Sr. Director of Product Development at Avalanche Technology

STT MRAM Technology and Productization (2.1MB pdf)


CBRAM for IoT applications

Nathan Gonzales, Adesto Technologies