Applied Materials Delivers Advanced ALD 200 mm Batch Technology to United Monolithic Semiconductors (UMS) for RF and Power Device Manufacturing

Applied Materials (prev. Picosun Oy) announce that they have delivered ALD technology to United Monolithic Semiconductors (UMS) for RF and power devices manufacturing. UMS is a compound semiconductor foundry and device manufacturer located in Ulm, Germany and Villebon, France. UMS produces RF devices, such as amplifiers, detectors, high-electron-mobility transistors and complete transceiver systems.

"We see the investment in the ALD technology as a key step forward. ALD is everyday technology in silicon-based IC and memory components and there are real benefits also for the compound semiconductor devices. We want to be the forerunner in our specific application fields, so including ALD in our process portfolio is one important step in staying ahead of the competition.​" - Dr. Klaus Zieger, Manager Process & Tools, UMS

United Monolithic Semiconductors (UMS) is a leading European company specializing in the design, manufacture, and marketing of radio frequency (RF) and millimeter-wave integrated circuits (MMICs. Established in 1996 as a joint venture between Thales and Airbus Defence and Space, UMS has become a strategic supplier to the European defense and space industries.

UMS offers a comprehensive range of products and services, including amplifiers, attenuators, core chips, detectors, converters, transistors, mixers, multipliers, oscillators, phase shifters, power divider combiners, RF front-ends, and switches.These products cater to various applications across defense, security, space, telecommunications, automotive, industrial, medical, and instrumentation sectors.

The company's technological foundation is built on in-house Gallium Arsenide (GaAs) and Gallium Nitride (GaN) processes, enabling the development of state-of-the-art products and providing a robust platform for their foundry services. UMS is committed to continuous innovation, collaborating with major research and development centers and universities throughout Europe to advance technologies and products for future markets.

Applied™ Morpher™ Batch ALD

Applied™ Morpher™ Batch ALD product platform is designed to disrupt thermal batch ALD for the up to 200 mm wafer industries in IoT, Communications, Automotive, Power, and Sensors (ICAPS) markets. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility.

Applied Morpher Batch ALD adapts to the changing needs of your industry and the requirements of your customers, on all business verticals from advanced R&D to production and foundry manufacturing. The leading versatility in substrate materials, substrate and batch size, and the wide process range make Morpher truly a transformable, all-inclusive ALD tool to keep you spearheading your industry.

Applied Morpher Batch ALD is designed for fully automated handling of wafer batches in combination with a single wafer vacuum cluster platform. Revolutionary, wafer batch flipping mechanism enables integration of the system with semiconductor manufacturing lines where most of the processing takes place in horizontal geometry. It can be combined with Applied™ Picosun™ Morpher™ P, plasma PEALD single wafer process module, or the Applied™ Picosun™ Morpher™ T, thermal ALD single wafer process module.

With our dual-chamber, hot-wall reactor design with fully separated precursor conduits and inlets, we create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and low cost-of-ownership.