The 2nd International Conference on ALD Applications & 3rd China ALD Conference Oct 16, 2014

The 2nd International Conference on ALD Applications & 3rd China ALD conference will be will be held in Shanghai, China, from October 16 to 17, 2014. It will be a two-day meeting, dedicated to the fundamental, materials, and applications of Atomic Layer Deposition (ALD) technology. It Following the success of the 1st and 2nd China ALD Scientific Meeting in 2010 and 2012, the 3rd China ALD 2014 conference will feature plenary sessions, poster sessions and an industrial exhibition. Papers submitted by students will be eligible for the“Best Student Paper Awards”

This conference will cover all aspects of ALD:
* ALD Precursors and Precursor Design
* Simulation, Modeling, and Theory of ALD
* ALD Surface Chemistry
* Surface Preparation for ALD
* Initiation of ALD Growth
* Patterned and Selective Area ALD
* In-situ Monitoring and Analysis
* Radical, Plasma and Other Energy-Enhanced ALD Methods
* Equipment and Manufacturing
* Applications of ALD for Microelectronics and Nanotechnology
* ALD for MEMS
* ALD for Catalytic, Photovoltaic, Optical, Magnetic Materials
* Characterization of ALD Coatings

IMPORTANT DATES
September 15, 2014—Abstract Submission Ends
September 20, 2014—Preregistration Opens
Please submit your abstract for Oral or Poster presentation to the
Email address: honglianglu@fudan.edu.cn and fzhang@semi.ac.cn

PROCEEDING AND FULL PAPER:
Full contributed papers will be peer reviewed and published
in a special issue Nanoscale Research Letters (2013 impact factor: 2.52).