Technical program for AVS ALD2019 and ALE2019 in Bellevue, Washington USA

Technical Program

Key Deadlines: Hotel Reservation Deadline: June 27, 2019 JVST Special Issue Deadline: November 1, 2019

Hotel Deadline is June 27

Hotel

Schedule

Register

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). The meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Download the ALD-ALE Mobile App Logging into the app allows you to access messaging, enable the synchronization of notes, favorites, and scheduled items between devices and the online scheduler. Click Here for Download Details

ALD/ALE 2019 Website

Plenary Speaker ·    Jeff Elam (Argonne National Lab, USA) ·    Eric Joseph (IBM, USA) ALD Invited Speakers ·    Silvia Armini (IMEC, Belgium) ·    Ageeth Bol (Eindhoven Univ. of Technology, Netherlands) ·    Jolien Dendooven (Ghent Univ., Belgium) ·    Eric Dickey (Lotus Applied Technology, USA) ·    John Ekerdt (Univ.of Texas, Austin, USA) ·    Fabio Grillo (ETH Zurich, Switzerland) ·    Hyeongtag Jeon (Hanyang Univ., South Korea) ·    Jessica Kachian (Intel, USA) ·    Rajesh Krishnamurthy (TechInsights/Chipworks, Canada) ·    Alex Martinson (Argonne National Lab, USA) ·    Niloy Mukherjee (Eugenus, Inc., USA) ·    Jin-Seong Park (Hanyang Univ., South Korea) ·    Henrik Pedersen (Linkoping Univ., Sweden) ·    Madhukar Rao (Versum Materials, USA) ·    Dina Triyoso (Tokyo Electron, USA) ·    Ginger Wheeler (U.S. Naval Research Lab, USA)

ALE Invited Speakers ·    Tomoko Ito (Osaka Univ., Japan) ·    Sabbir A. Khan (Niels Bohr Institute, Univ. of Copenhagen, Denmark) ·    Nobuyuki Kuboi (Sony Semiconductor Solutions Corp., Japan) ·    Xu Li (Univ. of Glasgow, UK) ·    Alfredo Mameli (TNO-Holst Centre, The Netherlands) ·    Angelique Raley (TEL Technology Center, America, USA) ·    Kazunori Shinoda (Hitachi Ltd, Japan) ·    Samantha Tan (Lam Research, USA) Tutorial Speakers ·    Area-selective ALD for Semiconductor Manufacturing, Stacey Bent (Stanford Univ., USA) ·    ALD for Battery Applications, Andy Sun (Western Univ., Canada) ·    ALD for Catalysis, Rong Chen (Huazhong Univ. of Science and Technology, China) ·    ALD for Photovoltaics, Bart Macco (Eindhoven Univ. of Technology, Netherlands) ·    Plasma Based ALE, Thorsten Lill, (Lam Research, USA) ·    Thermal Based ALE, Steve George (Univ. of Colorado at Boulder, USA)

ALD Program Chairs Program Chair: Sumit Agarwal (Colorado School of Mines, USA) Program Co-Chair: Dennis Hausmann (Lam Research, USA)

ALE Program Chairs Program Chair: Craig Huffman (Micron Technology, USA) Program Co-Chair: Gottlieb Oehrlein (University of Maryland, USA)