Friday, June 28, 2019

TSMC has presented several research papers at the VLSI Symposium held in Japan.

TSMC has presented several research papers at the VLSI (Very-large Scale Integration) Symposium held in Japan

At the symposium, TSMC covered technologies ranging from pre-package soldering for eMRAM to a new chiplet design based on ARM’s Cortex A72 cores. TSMC also introduced a research paper on tungsten disulphide; a channel material that the fab believes will allow for improved electron flow at 3nm and beyond due to improved 2D electron switching. This tungsten disulphide short-channel transistor is manufactured through chemical vapor deposition directly on the silicon substrate, as opposed to earlier processes that required a sapphire intermediary. One research paper was titled ‘A 7nm 4GHz Arm®-core A72 based CoWoS® Chiplet Design for High-Performance Computing’.
Source: wccftech LINK
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By Abhishekkumar Thakur

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