Thursday, August 20, 2015

New precursors for Atomic Layer Deposition presented at AVS ALD 2015 Portland

Here is a very good review from AVS ALD 2015 in Portland with respect to some of the new ALD precursor chemistries presented and discussed during the meeting by the ALD leading research labs and ALD industry like Intel, Adeka, BASF anad others.

New Reagents For Atomic Layer Deposition

Tailored ALD precursors form atomically thin layers of metals, dielectrics, and other compounds

By Mitch Jacoby
Chemical & Engineering News, Volume 93 Issue 32 | pp. 54-55, Issue Date: August 17, 2015
One way to shrink the nanosized wires (cross sections shown here) that interconnect electronic circuit components is to replace the “thick” tantalum nitride-like film used today to encapsulate the copper core (left) with a thinner manganese silicate film made via ALD.

Depositing thin films of copper is one thing. Making the metal stay put is quite another. “Copper has a nasty habit of diffusing if it’s not encapsulated with a protective barrier,” Gordon said. Running electric current through the tiny wires that interconnect transistors and other circuitry causes copper atoms to start migrating out of the wires, which eventually can lead to chip failure.

Gordon thinks ALD can help solve this problem. His group has developed an ALD process for making manganese silicate, a material that prevents copper diffusion at a film thickness of less than 2 nm. The chemistry is based on a reaction between a manganese amidinate compound and a silanol with tert-butoxy groups or other organic ligands. Gordon noted that there are other non-ALD ways to make manganese silicate films. But the Harvard group’s ALD method offers greater control over deposition and higher uniformity in chemical composition.

Shinjita Acharya reported on a proprietary barium pyrrole compound developed by BASF that is compatible with low-temperature ALD. Acharya is a postdoctoral researcher working with Stanford University mechanical engineer Friedrich B. Prinz, whose group is collaborating with BASF.

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