Thursday, January 10, 2019

Das Jahrestreffen der Plasma- und Vakuumexperten – V2019 + ALD


 

Das Jahrestreffen der Plasma- und Vakuumexperten – V2019

+ ALD (Vorlesung, Poster, Workshop)

Die Vorbereitungen laufen auf Hochtouren. Die V2019 wird in diesem Jahr wieder zahlreiche Experten, Anbieter, Nachwuchskräfte und Interessierte zur Vakuum- und Plasmaoberflächentechnik zusammenführen. Diesmal findet das Event in der Saalebene des Internationalen Congress Center Dresden (ICD) statt – welches gleich an die historischen, barocken Bauwerke der Altstadt anschließt. Die diesjährige V verbindet Bewährtes und Neues. Da sind neben Vorträgen und Fachgesprächen die zahlreichen Industrieaussteller aber auch neue Workshop-Themen, ein Fachkräfte-Scouting und Firmenbesichtigungen zu erleben. Seien Sie beim Branchentreff dabei. Zahlreiche Aussteller haben bereits Ihren Stand gebucht. 

Sichern Sie sich rechtzeitig Ihre repräsentative Ausstellungsfläche.

Semiconductor Materials Market will be +3% to $50.4B in 2019

TECHCET-the electronic materials advisory services firm providing business and technology information- announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 3.1% year-over-year (YoY) in 2019 to US$50.4B, of which 58% represents semiconductor fab materials. Steadily increasing demand for memory chips in 2018 lifted total materials market revenues to US$48.9B in 2018, while the compound annual growth rate (CAGR) through 2023 is forecast at 4.3% as detailed in the latest TECHCET Critical Materials Reports (CMR) and shown in the attached figure.


Global trade issues in 2018 run the risk of devolving into real trade wars, if governments and companies do not negotiate business terms from a place a mutual respect. "Wars can only have winners and losers," reminded Lita Shon-Roy, TECHCET President and CEO. "While issues can have win-win resolutions after mutually-respectful negotiations." 


At the 2018 Critical Materials Council (CMC) Seminar, held last October in Ningbo, China in coordination with China's IC Materials Technology Innovation Alliance (ICMtia), representatives of global chip-makers including Intel, GlobalFoundries, and Texas Instruments discussed ways to ensure electronic materials supply-chain robustness in an era of short-sighted protectionist tariffs. All three companies have high-volume manufacturing (HVM) fabs in mainland China along with the US, and all need to source a wide range of specialty materials from global suppliers.

During private face-to-face meetings between CMC fab members in Ningbo, held just after the public CMC Seminar, ON Semiconductor shared that they have a plan prepared to deal with tariffs goings into effect at different levels. Established HVM chip fabs must keep sourcing specialty materials regardless of political whims, because our modern world relies on a steady supply of semiconductor devices to maintain our communications, entertainment, health-care, and transportation infrastructures.

Critical Materials Reports™ and Market Briefings: https://techcet.com/shop/

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm focused on process materials supply-chains, electronic materials business, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports™, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. The Critical Materials Council (CMC) of semiconductor fabricators is a business unit of TECHCET, and includes materials supplier Associate Members. For additional information about reports, market briefings, CMC membership, or custom consulting please contact info(at)cmcfabs.org, +1-480-332-8336, or go to http://www.techcet.com or http://www.cmcfabs.org.

Call for Abstracts - AVS ALD 2019 and ALE 2019!


Call for Abstracts
Deadline February 15, 2019

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle).

As in past conferences, the meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.


Key Deadlines:
Abstract Submission Deadline: February 15, 2019
Author Acceptance Notifications: April 8, 2019
Early Registration Deadline: June 1, 2019
Hotel Reservation Deadline: June 27, 2019
JVST Special Issue Deadline: November 1, 2019




ALD Program Chairs

Program Chair:
Sumit Agarwal
(Colorado School of Mines, USA)

Program Co-Chair:
Dennis Hausmann
(Lam Research, USA)
ALE Program Chairs

Program Chair:
Craig Huffman
(Micron, USA)

Program Co-Chair:
Gottlieb Oehrlein
(University of Maryland, USA)