Download presentations from The Surface Preparation and Cleaning Conference (SPCC) 2016

Here are a lot of interesting presentation available for free download: https://spcc2016.com/downloads/

The Surface Preparation and Cleaning Conference (SPCC) 2016

The Surface Preparation and Cleaning Conference (SPCC) is an annual event which brings together prominent researchers from the semiconductor industry and the university community to focus on developments and challenges in advanced wafer and mask cleaning and surface preparation technologies. 

Join industry experts from around the globe representing IC manufacturers, suppliers, and research organizations to present and discuss the industry’s best available data on wafer, mask and part cleaning technologies and solutions:

• Wafer front-end
• Wafer back-end
• Post CMP
• Packaging
• Advanced mask
• Equipment and parts
• Environment, safety and health issues

My favorites:

INVITED: Electron beam generated plasmas: Ultra cold sources for low damage, atomic layer processing — Scott Walton, Naval Research Lab


Selectivity in Atomic Layer Etching Using Sequential, Self-Limiting Thermal Reactions — Steve George, Univ. of CO

Novel Reactive Chemistry Sources for Surface Passivation of Future Generation Channel Materials — Dan Alvarez, Rasirc

Behold - Solmates PLD is the next disruptive deposition technology following ALD

Behold ALD people - After defeating both PVD and CVD numerous times there will be now rest for the PLD guys ar coming - Solmates’ PLD platform is the next disruptive deposition technology following the adoption of atomic layer deposition (ALD) for thin film manufacturing - Welcome to the club PLD people!

ENSCHEDE, the Netherlands, April 18^th 2016- Solmates has received an important and high profile order for its Pulsed Laser Deposition (PLD) equipment from world–leading nanoelectronics research center imec.  The system is scheduled for delivery to imec in Leuven, Belgium during Q2 2016.

Solmates’ advanced PLD equipment is fundamental in helping to accelerate the entry of new processes into commercial products. It plays a key role in the development of future chip designs and the integration of new materials for next generation transistors.

Solmates will become a member of imec’s Industrial Affiliation Program (IIAP) Beyond CMOS. This program focuses on the integration and benchmarking of novel device concepts beyond traditional transistor scaling. These include piezoelectrics for alternative computing devices and 2D materials such as graphene and MoS2 for ultimate scaling.

“This important and significant deal fits our roadmap towards mainstream CMOS compatibility,” commented Solmates’ CEO Arjen Janssens, “Imec is a world-leading center for nanoelectronics with significant global partnerships and therefore represents the perfect gateway to this key market.”

Solmates’ PLD platform is the next disruptive deposition technology following the adoption of atomic layer deposition (ALD) for thin film manufacturing. The technology uses a laser to create a plasma of the material to be deposited, enabling industrial quality deposition of new generation materials. An automated tool offers high yield, customized deposition of various ‘More than Moore’ materials on a wide variety of different substrates. The technology is already in use at various customer sites and several processes are qualified for (Piezo) MEMS, LED and PowerIC applications. Solmates owns key patents related to PLD technology and processes.

ALD and CNT template produces sub-5 nm features

As reported by Nanotechweb.org : Researchers at Korea University are reporting on a new way to make nano-trenches less than 5 nm deep with a technique called atomic-layer deposition (ALD), and single-walled carbon nanotubes as templates. The structures produced could be used to make high-density resistive components for a wide range of nanoelectronics devices.

Full story here

(a) Schematic diagram representing the creation of SiO₂ nano-trenches. AFM image of (b) nano-trenches after further reactive ion etch of SiO₂ through an alumina mask, and (c) SiO₂ nano-trenches obtained by an additional etching in RIE and wet etching of alumina. Courtesy: Nanotechnology

Applied Materials on the challenges of bringing new ALD Precursors to production

Here is an excellent interview with Dr. David Thompson, Senior Director, Center of Excellence in Chemistry,  Applied Materials on the challenges of bringing new ALD Precursors to production. For those of you who still have the possibility there will be a opportunity to meet and talk to David Thompson at the CMC Conference 5-6th of May (see details below).

Controlling Variabilities When Integrating IC Fab Materials

By Ed Korczynski, Senior Technical Editor, SemiMD/Solid State Technology,
copyright ©2016 Extension Media

Semiconductor integrated circuit (IC) manufacturing has always relied upon the supply of critical materials from a global supply chain. Now that shrinks of IC feature sizes have begun to reach economic limits, future functionality improvements in ICs are increasingly derived from the use of new materials. The Critical Materials Conference 2016—to be held May 5-6 in Hillsboro, Oregon (cmcfabs.org)—will explore best practices in the integration of novel materials into manufacturing. Dr. David Thompson, Senior Director, Center of Excellence in Chemistry, Applied Materials will present on “Agony in New Material Introductions – minimizing and correlating variabilities,” which he was willing to discuss in advance with SemiMD.

The full interview by By Ed Korczynski, Senior Technical Editor, SemiMD/Solid State Technology and Co-CHair of The CMC Conferecne is published in SemiMD and can be found here: http://semimd.com/blog/2016/04/15/controlling-variabilities-when-integrating-ic-fab-materials/  

Buy Reports  | CMC Fabs   |  CMC Conference  |  Register Now

New Additions to a Powerful Lineup  May 5-6, Hillsboro, Oregon The Critical Materials Conference provides a framework to catalyze the flow of actionable technical and supply chain information related to critical materials.  New Additions to the Critical Materials Conference Include:  David Thompson, Ph.D., Director of Process Chemistry of Applied Materials Agony in New Material Introductions - Minimizing and Correlating Variabilities Toshi "Tommy" Oga, Ph.D., Gigaphoton Inc. Neon Efficiency Improvement/Recycling Dan Alvarez, Ph.D., Chief Technology Officer - RASIRC Hydrazine as a Low Temperature Nitride Source: Materials Challenges for High Volume Manufacturing This year's conference also features speakers from  Intel, Micron, Veeco, and Air Liquide; among more than 20 powerful & actionable presentations A highly differentiated program, with networking opportunities for all attendees.  For full agenda details click here. Conference themes center around the Critical Materials Council and global IC fabrication industry needs. While executive conferences typically focus on the "what" and "why" of materials technologies, this conference also discusses "how" new materials can be controllably, safely, and cost-effectively used in fabs. Additionally the Conference includes market data to validate "when" materials will be needed. Attendees from fabs, OEMs, and materials suppliers alike have the opportunity to interact with the presenters and colleagues, to gain insights into the best practices of the entire supply-chain. For more information on the conference go to www.cmcfabs.org/seminars/  Great Sponsorship Opportunities available,  please contact cmcinfo@techcet.com or call 1-480-382-8336 Sponsors and Committee

Tesla coil causes carbon nanotubes to self-assemble into long wire

This is a cool must watch video on self assembly of carbon nano tubes into long wires from researchers at Rice University. HOUSTON – (April 14, 2016) – Scientists at Rice University have discovered that the strong force field emitted by a Tesla coil causes carbon nanotubes to self-assemble into long wires, a phenomenon they call “Teslaphoresis.”

 The team led by Rice chemist Paul Cherukuri reported its results this week in ACS Nano. - See more at: http://news.rice.edu/2016/04/14/nanotubes-assemble-rice-introduces-teslaphoresis/#sthash.LeL6G50r.dpuf

Teslaphoresis of Carbon Nanotubes

Lindsey R. Bornhoeft, Aida C. Castillo, Preston R. Smalley, Carter Kittrell, Dustin K. James, Bruce E. Brinson, Thomas R. Rybolt, Bruce R. Johnson, Tonya K. Cherukuri, and Paul Cherukuri

 

ACS Nano, Article ASAP

DOI: 10.1021/acsnano.6b02313

 

This paper introduces Teslaphoresis, the directed motion and self-assembly of matter by a Tesla coil, and studies this electrokinetic phenomenon using single-walled carbon nanotubes (CNTs). Conventional directed self-assembly of matter using electric fields has been restricted to small scale structures, but with Teslaphoresis, we exceed this limitation by using the Tesla coil’s antenna to create a gradient high-voltage force field that projects into free space. CNTs placed within the Teslaphoretic (TEP) field polarize and self-assemble into wires that span from the nanoscale to the macroscale, the longest thus far being 15 cm. We show that the TEP field not only directs the self-assembly of long nanotube wires at remote distances (>30 cm) but can also wirelessly power nanotube-based LED circuits. Furthermore, individualized CNTs self-organize to form long parallel arrays with high fidelity alignment to the TEP field. Thus, Teslaphoresis is effective for directed self-assembly from the bottom-up to the macroscale.