Semiconductor Today reports that Researchers based in China and the USA have improved the crystal quality of gallium nitride (GaN) thin films on sapphire from a 350°C low-temperature plasma-enhanced atomic layer deposition process (PE-ALD) using an in-situ bake and plasma substrate pretreatment.
Source: Baking and plasma-enhanced low-temperature gallium nitride atomic layer deposition, Moke Cooke, Semiconductor Today LINK
Journal Publicarion Sanjie Liu et al, Appl. Phys. Lett., vol116, p211601, 2020 https://doi.org/10.1063/5.0003021
Source: Baking and plasma-enhanced low-temperature gallium nitride atomic layer deposition, Moke Cooke, Semiconductor Today LINK
Journal Publicarion Sanjie Liu et al, Appl. Phys. Lett., vol116, p211601, 2020 https://doi.org/10.1063/5.0003021
No comments:
Post a Comment