Saturday, March 9, 2019

Western Digital and Toshiba have developed a 128-layer 3D NAND die with TLC (3bits/cell) cell formatting and 512Gbit capacity.Acoording to etimates and modelling WD-Toshiba has the industry’s highest NAND density and models the suppliers at an 85 per cent wafer yield - thanks Terry Francis for sharing.



No comments:

Post a Comment