Monday, October 2, 2017

The world´s leading foundry selects Nova VeraFlex III XF XPS for critical Logic ALD process monitoring

REHOVOT, Israel: Nova (Nasdaq: NVMI), a leading innovator and a key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that its most advanced XPS platform was selected by the world's leading Foundry for inline applications to be deployed in its advanced technology nodes. Revenue from this order is expected to be recognized during the third quarter of 2017.
The VeraFlex III XF combines enhanced XPS capability with a unique low energy XRF (LE-XRF) channel to address the metrology challenges of 20nm nodes and beyond. The VeraFlex III XF is the third generation of the globally adopted VeraFlex series of XPS production systems. With technology enhancements that improve performance on current inline logic and memory film applications, the VeraFlex III XF provides solutions for emerging applications in FinFET HKMG, interconnect processes, and advanced memories. (

The VeraFlex III XF is the latest generation of the VF XPS series, which offers superior sensitivity to sub-angstrom thickness and composition characterization used for monitoring critical processes such as atomic layer deposition (ALD) at the most advanced Logic nodes.

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Here's a link to the original PR:

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