Monday, July 11, 2016

Applied Materials Releases Selective Etch Tool - The Producer® Selectra™ Etch system

As reported by By Ed Korczynski, Sr. Technical Editor Solid State Technology : Applied Materials has disclosed commercial availability of new Selectra(TM) selective etch twin-chamber hardware for the company’s high-volume manufacturing (HVM) Producer® platform. Using standard fluorine and chlorine gases already used in traditional Reactive Ion Etch (RIE) chambers, this new tool provides atomic-level precision in the selective removal of materials in 3D devices structures increasingly used for the most advanced silicon ICs. The tool is already in use at three customer fabs for finFET logic HVM, and at two memory fab customers, with a total of >350 chambers planned to have been shipped to many customers by the end of 2016.

Fulls story :

Full information as released by Applied Materials can be found here :

The Producer® Selectra™ Etch system introduces unprecedented capabilities for sustaining the momentum of Moore’s Law through further scaling of 3D logic and memory chips. This process can remove target materials with unprecedented selectivity to one or more films. (

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