Thursday, July 19, 2018

SVC TechCon 2019 Long Beach California has a new session for Atomic Layer Processes

The SVC has added a session entitled Emerging Technologies and Plasma Processes Focused on Atomic Layer Processes to its 2019 TechCon in Long Beach, California (LINK).

Joint Session of Emerging Technologies and Plasma Processes focused on Atomic Layer Processes (ALP) 

Over the last few years, atomic layer processes (ALPs), including atomic layer deposition (ALD),  etch (ALEt), and chemical modification, have increased in importance, enabling many new products and applications. With precise control and versatility, ALPs have become indispensable nanoscale manufacturing processes and the self-controlling aspects of these processes are finding microelectronics applications in high insulation thin-films, thin film transistors, and nanostructuring. ALP processes are becoming enabling technologies for precise coating and producing nanostructures; special properties of such a billionth of a meter in size structure hold immense technological application potential. However, ALPs are not limited for coating of inorganic thin-films. Recent advances in low temperature processing makes this methods also attractive for the coating of biomaterials. 
With this joint session of Emerging Technologies and Plasma Processes we are in a unique position to bundle expertise and synergies for technological breakthroughs, new trends, and innovations. We are soliciting contributions to this session in the following areas: ALP fundamentals, innovative application of established ALD technologies, or creative new developments in ALP technologies. Advanced ALP technologies which successfully cross over from early‐stage feasibility studies into commercially viable industry solutions are also of interest.

Deadline for Abstracts: October 5, 2018

Topics of this joint session between the SVC’s Plasma Processing and Emerging Technologies TACs will include:
  • Fundamental aspects for atomic layer processes (ALPs)
  • Atomic layer processes for diverse applications
  • Plasma-enhanced processes
  • Innovations in methods and progress in upscaling of atomic-/molecular-layer processes (ALD/ ALEt / MLD) towards high-volume industrial applications
  • Novel concepts and technologies for ALP process control, monitoring and thin-film characterizationModelling of atomic layer processes
  • Combined coatings of PVD and ALP
  • Advanced ALP thin-film processing, challenges and applications
  • Creative new business concepts or market perspectives that accelerate transfer of ALP technologies from lab-scale to commercial viability
We welcome contributed talks and posters for these areas, and always consider new and innovative topics that advance the use of thin film processing in atomic layer processing.

TAC Chairs:
Manuela Junghähnel, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma
Technology FEP, Germany,

Lenka Zajickova, Central European Institute of Technology, Masaryk University, Czech Republic,

SVC TechCon Background
The SVC TechCon will be in sunny Long Beach, California for 2019! SVC has a new venue and our Symposium topic will encompass a broad range of commercially relevant issues and technologies. SVC offers an industryleading technical exhibition, abundant networking opportunities, with an extensive educational program and in-depth technological expertise. SVC provides you with a great opportunity to present your latest research results, coating processes and equipment applications in the field. We invite you to share your latest R&D and application successes with the SVC community. 

The TechCon offers a broad range of presentation options – technical talks or posters, vendor innovation presentations – which can accommodate the full spectrum of academic research and industrial product innovations. This is complemented by our publication options of conference proceedings or a peer-reviewed publication. The SVC Student Sponsorship Program provides financial support for a limited number of qualified applicants to encourage student participation. 

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