REHOVOT, Israel: Nova (Nasdaq: NVMI), a leading innovator and a key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that its most advanced XPS platform was selected by the world's leading Foundry for inline applications to be deployed in its advanced technology nodes. Revenue from this order is expected to be recognized during the third quarter of 2017.
The VeraFlex III XF combines enhanced XPS capability with a unique low
energy XRF (LE-XRF) channel to address the metrology challenges of 20nm
nodes and beyond. The VeraFlex III XF is the third generation of the
globally adopted VeraFlex series of XPS production systems. With
technology enhancements that improve performance on current inline logic
and memory film applications, the VeraFlex III XF provides solutions
for emerging applications in FinFET HKMG, interconnect processes, and
advanced memories. (http://www.novameasuring.com/veraflex3xf.html)
The VeraFlex III XF is the latest generation of the VF XPS series, which offers superior sensitivity to sub-angstrom thickness and composition characterization used for monitoring critical processes such as atomic layer deposition (ALD) at the most advanced Logic nodes.
Full story : LINK
Here's a link to the original PR:
http://ir.novameasuring.com/press_releases/novas-advanced-xps-solution-selected-by-the-worlds-leading-foundry/
Full story : LINK
Here's a link to the original PR:
http://ir.novameasuring.com/press_releases/novas-advanced-xps-solution-selected-by-the-worlds-leading-foundry/
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