Thursday, August 31, 2017

Picosun reports repeat sales of ALD 200 mm Batch tools to major Asian discrete device manufacturers

ESPOO, Finland, 31st August, 2017 – Picosun Oy, leading supplier of high-quality Atomic Layer Deposition (ALD) solutions for industrial production, reports of repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. 
 
The PICOSUN™ P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones. (picosun.com)
 
Even if the 300 mm wafer size is the current state-of-the-art in many key semiconductor applications, and efforts have been made to increase this size even to 450 mm, the 200 mm market is very much alive and showing no signs of tailing off. One main factor supporting this steadfast longevity is the increasing usage of substrate materials such as GaN, SiC, and sapphire, where the wafer size is limited to 200 mm, or even smaller. These substrates have many benefits over traditional silicon and they allow manufacturing of components that are central in several technologies affecting our everyday life and the modern society. Examples are LED lighting, car and transport automation, power conversion, wireless communication and remote sensing. A prime example of the last two is the rapidly spreading Internet-of-Things with the billions of sensors forming its core. All of these applications ensure that the demand for 200 mm semiconductor production equipment stays at constant high and even increases.

Picosun answers this demand with its PICOSUN™ P-300BV ALD system, designed for fast batch processing of wafers up to 200 mm size. The P-300BV ALD system is ideal for e.g. MEMS and compound semiconductor production. It is equipped with single or dual vacuum load lock system for semi-automatic loading and unloading of substrates under constant vacuum, enabling deposition of nitrides and other sensitive materials. Wafer carriers of metal and quartz are available, depending on application. Full integration to factory automation is possible via SECS/GEM protocol.

“The P-300BV system has been a success amongst our key production customers. As so many central semiconductor applications and emerging technologies of today utilize 200 mm substrates, there has been even a shortage of suitable manufacturing equipment. We at Picosun are happy to help in this and supply the market with our production-proven ALD tools and solutions specifically designed and optimized for 200 mm production,” summarizes Juhana Kostamo, Managing Director of Picosun Oy.