Friday, April 7, 2017

Mikko Utriainen VTT Finalnd explains PillarHall ALD test structures

PillarHall® silicon wafers and chips enable easy analysis of thin film conformality using well-defined, record-demanding microscopic 3-D structures. Typical usage areas are atomic layer deposition and chemical vapor deposition R&D. 

PillarHall® silicon wafers and chips (http://www.pillarhall.com/)
 
PillarHall introduction in SlideShare.


Scientific articles (newest first) created with PillarHall® microscopic lateral high-aspect-ratio (LHAR) test structures:
1.  Influence of ALD temperature on thin film conformality: Investigation with microscopic lateral high-aspect-ratio structures
R. L. Puurunen, F. Gao, Proceedings of the International Baltic Conference on Atomic Layer Deposition, 2-4 Oct 2016, St. Petersburg, Russia. Electronically published in IEEE Xplore, http://ieeexplore.ieee.org/document/7886526/
2. Nucleation and Conformality of Iridium and Iridium Oxide Thin Films Grown by Atomic Layer Deposition
M. Mattinen, J. Hämäläinen, F. Gao, P. Jalkanen, K. Mizohata, J. Räisänen, R. L. Puurunen, M. Ritala, M. Leskelä, Langmuir 32 (2016) 10559-10569.
http://dx.doi.org/10.1021/acs.langmuir.6b03007
3.  Microscopic silicon-based lateral high-aspect-ratio structures for thin film conformality analysis
F. Gao, S. Arpiainen, R. L. Puurunen, J. Vac. Sci. Technol. A (letter) 33 (2015) 010601 (5 pages).
http://dx.doi.org/10.1116/1.4903941, open access [PDF].