Tuesday, May 10, 2022

Semiconductor Materials at a Critical Tipping Point - Key Industry Issues Revealed

San Diego, CA, May 10, 2022: TECHCET—the electronic materials advisory firm providing business and technology information— held its highly successful and well-attended 2022 Critical Materials Conference in Chandler, Arizona on April 28th and 29th. Over 300 attendees and speakers participated in the event to hear about and to discuss semiconductor material issues and trends that are critical to the entire semiconductor industry supply chain—now and in the future.

2022 CMC Conference Keynote Speaker, John Whitman, Corporate Vice President, Operations Central Team & Procurement at Micron Technologies Corp., and Karey Holland, Ph.D., Sr. Advisor and CMC Conference Co-Chair, TECHCET

The opening keynote for the conference was delivered by John Whitman, Corporate Vice President, Operations Central Team & Procurement; Micron Technologies Corp. and addressed the topic of “Covid Impacts on our Supply Assurance Playbook”. The Covid pandemic and subsequent logistic and other supply chain issues over the past two years have highlighted critical issues for the semiconductor industry. Just-in-time delivery has lessened as a procurement priority, and now manufacturers focus on supply chain stability. It is important for device makers to build their supply chain around Business Continuity Plans (BCP) so to ensure production schedules are maintained.

Industry-wide, there is an opportunity for companies to share information through digitization of supply-chain data. With sharing of information and data, companies across the supply chain can collaborate and solve critical issues with respect to materials delivery and performance, thus optimizing semiconductor processing.

This technical conference includes 5 impactful sessions with focuses on 1) Business Trends & Global Issues, 2) Immediate Challenges of Materials & Manufacturing, 3) Future Challenges for Equipment & Component Processes, 4) Emerging Materials & Processes, and 5) Materials for Advanced Packaging and Heterogeneous Integration.

The Conference has just opened up registration for “After Hours” interaction offering online viewing of presentation videos and pdf downloads, and virtual networking opportunities with other “attendees.”On Day 1, sessions 1 through 3 cover a gamut of topics critical to the semiconductor industry supply chain. Topics from the industry outlook for devices, semiconductor manufacturing equipment and materials, to water supply challenges, green manufacturing initiatives, and workforce development were all discussed.
On Day 2, the event focused on emerging materials applications including materials needed for 3nm and smaller technology nodes as well as material challenges of interposes versus bridges and other issues concerning wafer level modeling materials.

For more information about how to attend the CMC Conference After Hours, go to:

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