Saturday, September 1, 2018

Announcing Kronos™ 1080 and ICOS™ F160 Inspection Systems: Expanding KLA-Tencor's IC Packaging Portfolio

KLA-Tencor has announced it is expanding its integrated circuit (IC) packaging portfolio with two new defect inspection products designed to address a wide variety of IC packaging challenges: KronosTM 1080 and ICOS™ F160. The two new inspection systems join KLA-Tencor’s portfolio of defect inspection, metrology and data analysis systems that help accelerate packaging yield and increase die sort accuracy. You may find the official release here;

  • Kronos 1080 – offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition.
  • ICOS F160 – examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types—including sidewall cracks, a new defect type affecting the yield of high-end packages. 
 Kronos™ 1080 and ICOS™ F160 (Image shared by KLA-Tencor)

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