Saturday, February 22, 2014

Interview with Beneq's technical sales director ALD-based OLED encapsulation technology

Interview with Beneq's technical sales director ALD-based OLED encapsulation technology:

"- ALD is the only truly conformal and pinhole-free thin-film encapsulation technology. Due to the pinhole-free nature of ALD films, ultra-thin layers (i.e. 10’s of nm's) of inorganic material (e.g. Al2O3) is sufficient for OLED encapsulation. Ultra-thin layers are also compatible with future needs for flexibility. Conformality is advantageous e.g. in elimination of side-diffusion, the OLED device can extend to the very edge of the device and still be reliably encapsulated. Finally, the ALD material costs are very low, and overall cost-of-ownership is very competitive.


- ALD is uniquely well suited for flexible OLEDs, due to the ultra-thin layers which are compatible with the future flexibility requirements. I would go as far as to say that ALD will enable future flexible OLED products."

- Beneq's director of Technical sales, Mikko Söderlund
 
Complete Interview with some interesting insights into the ALD OLED business and also comments with respect to Synos/Veeco Fast-ALD(TM) technology.
 
 
For more information on all kind of OLED Technology this site has a lot to offer on flexible OLED and all othe topics as well: http://news.oled-display.net

 
The film stack building up an OLED on a flexible substrate such as flexibel glass, plastic or a metal foil (schematic above from OLED-Display.net).
 
According to Erich Strasser at OLED-Display.net there are the development and market entry stages:
  • very thin > 0.25mm, light, unbreakable
  • Bendable, ready for production (Galaxy Round, LG-Flex)
  • Rollable, completely flexible –> ready 2016
  • Printable, displays like a paper –> ready 2018-2020