Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes
Aniruddha Joi, Kailash Venkatraman, Kuang-Chih Tso, Dries Dictus, Yezdi Dordi, Pu-Wei Wu, Chih-Wen Pao and Rohan Akolkardoi: 10.1149/2.0181909 jss ECS J. Solid State Sci. Technol. 2019 volume 8, issue 9, P516-P521
Process flow for adhesion testing by scratch and peel method for (a) Cu/Cu-Zn/Ru/SiO2 and (b) Cu/Ru/SiO2 stack without the Zn-containing interlayer.
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