Beneq’s Transform® ALD Tool Qualified for High-Volume GaN Power Device Production by Leading Asian Manufacturer

Beneq has announced the qualification of its Transform® ALD cluster tool for high-volume production of GaN-based power devices on 8-inch GaN-on-Si wafers by a major Tier 1 manufacturer in Asia. This achievement marks a significant step in the adoption of Beneq’s ALD technology for high-performance, scalable, and reliable GaN semiconductor applications, which are essential for power electronics and RF devices in sectors such as automotive, datacenters, and consumer electronics. The Transform system’s unique three-step process—including plasma-based surface pre-cleaning, plasma-enhanced ALD, and thermal ALD—ensures high-quality dielectric integration for wide-bandgap semiconductors like GaN and SiC.

Beneq Transform® establishes a completely new class of ALD cluster tool products in it’s versatility and adaptability to address a broad range of applications and market segments. Beneq Transform® configure with multiple ALD process modules to meet a specific wafer capacity requirement or be later upgraded in response to growing volumes or with new ALD applications. (Beneq.com)

According to Yole Intelligence, the power GaN market is set to surpass $2.2 billion by 2029, growing at a robust 41% CAGR from 2023. This tenfold expansion since 2019 is driven primarily by consumer electronics—especially fast chargers—followed by strong momentum in automotive, data center, telecom, and industrial applications. GaN's adoption is expanding into 300W mobile chargers, automotive LiDAR and onboard chargers (OBCs), high-efficiency power supplies for data centers, and future intermediate bus converters. Bidirectional GaN devices and applications in e-bikes, home appliances, and over-voltage protection (OVP) units are also contributing to market penetration.

The ecosystem is rapidly evolving, with over $4 billion invested in Power GaN since 2019 and major M&A activity including Infineon’s acquisition of GaN Systems and Renesas buying Transphorm. IDMs like STMicroelectronics, Nexperia, and Samsung are building capacity, while 8-inch GaN-on-Si is becoming standard, and early work on 12-inch is underway. Technical advances include 1200V GaN devices, bidirectional switches, and GaN-on-QST substrates. While the market is promising, failures like NexGen and BelGaN highlight the risks and capital intensity required for success​. (Yole Development)

The Beneq Transform tool's vacuum-integrated cluster design supports nitride and oxide film deposition with high throughput and competitive cost-of-ownership, making it suitable for HEMTs, integrated circuits, and vertical devices. Seventeen Transform units are now deployed globally in GaN manufacturing and R&D. The company also strengthens its GaN process innovation through its partnership with imec, where a newly installed Transform system supports ongoing research in GaN surface treatment and dielectric integration.

Key Features of the Transform GaN ALD Process

1. Three-Step ALD Process (Proprietary Architecture):

• Plasma-based surface pre-cleaning: Critical for removing contaminants and native oxides from GaN or SiC surfaces to ensure interface integrity.
• Plasma-enhanced ALD (PEALD) of interfacial layers: Enables low-temperature, conformal deposition with precise control, which is essential for GaN where thermal budgets are constrained.
• Thermal ALD of dielectric films: Offers dense and high-quality films with excellent electrical properties for gate dielectrics and passivation layers.

2. Materials Supported:

• Nitrides: AlN, SiN – important for barrier layers, passivation, or etch stops.
• Oxides: Al₂O₃, HfO₂, SiO₂ – used for gate dielectrics, field plates, and interface engineering.

Sources:

Beneq Transform® Qualified for GaN Power Device Production by Tier 1 Asian Manufacturer

Yole Group - Follow the latest trend news in the Semiconductor Industry

Jusung Engineering Records Strong Financial Performance and Expands ALD Equipment Shipments in 2024

Jusung Engineering Ltd. (KOSDAQ:036930) maintains a strong financial position with a net cash balance of ₩187.2 billion, as its cash reserves of ₩232.2 billion significantly exceed its ₩45.0 billion in debt. Despite total liabilities exceeding cash and receivables by ₩109.4 billion, the company's market capitalization of ₩1.37 trillion suggests that these obligations do not pose a substantial risk. Jusung Engineering's EBIT grew by an impressive 211% over the past year, further strengthening its ability to manage debt. Additionally, with free cash flow amounting to 80% of EBIT over the last three years, the company demonstrates solid cash flow management, reducing concerns over its debt burden. Given these factors, Jusung Engineering appears financially stable, with strong earnings and liquidity to support future growth.

Jusung Engineering shipped atomic layer deposition equipment for DTC silicon capacitor production on the 17th of last month.

In May 2024, Jusung Engineering unveiled plans to restructure its business by spinning off its semiconductor, solar, and display divisions into separate entities. The strategic move aimed to enhance operational efficiency and create greater shareholder value. However, by October 2024, the company decided to cancel the spin-off due to opposition from shareholders. The total stock purchase price for the stocks exercised in opposition exceeded KRW 50 billion, leading to the decision to maintain the company's current structure.

Beyond its financial success, Jusung Engineering made notable advancements in its technology offerings. In November 2024, the company shipped Atomic Layer Deposition (ALD) equipment for the production of Deep Trench Capacitor (DTC) Silicon Capacitors to Elspeth. 

Jusung Engineering's strong financial results, strategic decisions, and technological advancements reinforce its position as a key player in the global semiconductor industry. 

References:

JUSUNG ENGINEERINGLtd (KOSDAQ:036930) Could Easily Take On More Debt - Simply Wall St News

https://www.mk.co.kr/en/business/11231493
https://www.businesskorea.co.kr/news/articleView.html?idxno=216376
https://www.marketscreener.com/quote/stock/JUSUNG-ENGINEERING-CO-LTD-6494704/news/JUSUNG-ENGINEERING-Co-Ltd-cancelled-the-Spin-Off-of-Semiconductor-equipment-research-and-developme-48189649/
https://www.mk.co.kr/en/business/11164246

Forge Nano Expands ALD Capabilities with New TEPHRA™ Cluster Tool and State-of-the-Art Cleanroom

Forge Nano has significantly expanded its semiconductor atomic layer deposition (ALD) capabilities with the completion of a new 2,000 sq ft cleanroom dedicated to manufacturing its TEPHRA™ ALD cluster tools. This expansion comes in response to increased demand for high-throughput ALD solutions in the 200mm wafer market, particularly for advanced packaging, power semiconductor, and microelectromechanical system (MEMS) applications. The new facility, featuring Class 10 (ISO 4) cleanroom space and a dedicated metrology lab, will enable Forge Nano to accelerate production, conduct customer demonstrations, and validate ALD process integration for commercial-scale adoption.

The TEPHRA™ cluster tool is designed to deliver ultrathin, uniform coatings with 10x the throughput of traditional ALD systems, supporting applications such as conformal metal barrier seed layers for through-silicon and through-glass vias (TSVs and TGVs). With customer tool deliveries expected in early 2025, Forge Nano is inviting industry partners to on-site demonstrations showcasing TEPHRA’s capabilities. This expansion reinforces Forge Nano’s position as a key enabler of next-generation semiconductor manufacturing, offering efficient and scalable ALD solutions for the growing demand in advanced node technologies.

Sources:

Blog - Forge Nano

Lam Research’s Dry Resist: A Breakthrough in EUV Lithography for Next-Generation Logic and Memory Manufacturing

Lam Research’s dry resist technology represents a major shift in EUV lithography and semiconductor patterning, addressing critical challenges such as stochastic defectivity, resolution limitations, and cost-efficiency. With recent qualifications for advanced DRAM and 2nm logic manufacturing, along with a growing ecosystem for high-volume production, dry resist is positioned to disrupt traditional chemically amplified resists (CARs) and enable future High-NA EUV adoption.

One of the most significant recent developments is Lam’s qualification of dry resist for 28nm pitch BEOL logic at 2nm and below in collaboration with imec. This qualification confirms that dry resist can eliminate multi-patterning steps, reducing complexity and improving EUV throughput. The process is designed to work with both low-NA and high-NA EUV scanners, ensuring its relevance for sub-2nm logic scaling. This represents a key milestone in extending direct EUV printing to future logic nodes, an approach that could significantly lower lithography costs while improving pattern fidelity.

In addition, a leading DRAM manufacturer has selected Lam’s Aether dry resist technology as its production tool of record for advanced DRAM nodes. This decision highlights dry resist’s low-defect, high-fidelity patterning capabilities, which are essential for scaling memory architectures. The technology enables lower exposure doses while reducing stochastic defects, which are a major concern in EUV-based DRAM production. Given that Samsung, SK Hynix, and Micron are all increasing their reliance on EUV for next-generation DRAM, Lam’s dry resist is well-positioned for widespread adoption in the memory sector.

To ensure a stable supply chain for dry resist materials, Lam Research has partnered with Entegris and Gelest, a Mitsubishi Chemical Group company. This collaboration ensures reliable dual-source precursor production, providing chipmakers with long-term process stability. The partnership also focuses on the development of next-generation high-NA EUV precursors, further strengthening dry resist’s role in future sub-2nm manufacturing.

SEM images of 28 nm pitch line/space patterns imaged with 0.33NA EUV in dry resist from Entegris precursor.

A critical enabler of dry resist technology is its atomic layer deposition (ALD) process, which replaces traditional spin-coating used in CARs. ALD-based vapor-phase deposition offers higher uniformity, eliminating polymer chain variations found in conventional resists. It also allows precise thickness control, which is essential for optimizing EUV photon absorption and etch selectivity. Unlike CARs, which rely on a complex mixture of polymers, dry resist materials are based on single-component metal-organic precursors such as organo-tin oxides. These materials provide higher EUV photon absorption, improving sensitivity and pattern resolution.

Another key advantage of dry resist is its anisotropic dry development process, which replaces wet solvent-based development. Traditional CAR-based EUV resists require organic solvents or aqueous bases, leading to stochastic defects, material loss, and waste. Dry resist, by contrast, is developed entirely in the gas phase, selectively removing unexposed regions and forming a negative-tone image. This eliminates line collapse and delamination issues, improving yield stability. Additionally, the elimination of wet chemistries significantly reduces chemical waste, making dry resist a more sustainable solution with five to ten times lower material consumption compared to traditional resists.

Lam’s dry resist technology is poised to disrupt traditional CAR-based EUV lithography, particularly as the industry moves toward High-NA EUV adoption. By reducing multi-patterning dependency, the technology enhances cost-effective EUV scaling, making it an attractive solution for both logic and memory manufacturers. This positions Lam as a key leader in next-generation EUV resist solutions, challenging conventional resist suppliers like JSR, TOK, and Inpria.

From a sustainability perspective, dry resist significantly lowers EUV exposure dose requirements, leading to higher scanner throughput and lower energy consumption. Its reduced defectivity translates to higher yield per wafer, further enhancing cost-efficiency. The collaboration with Entegris and Gelest ensures supply-chain stability, making dry resist a viable and scalable technology for sub-2nm nodes.

The patent US20220020584A1 mentions several Lam Research tools that play a role in the dry resist deposition, patterning, and development process for EUV lithography. The Altus system is referenced for deposition, likely for metal or dielectric films in the dry resist stack, while the Striker plasma-enhanced atomic layer deposition (PEALD) system may be used for precise resist or underlayer deposition. The Versys platform, known for plasma processing, is relevant to the dry development process, and the Syndion system, typically used for deep silicon etching, may have applications in pattern transfer. Additionally, the Reliant tool is designed for volume manufacturing, possibly adapted for integrating dry resist technology, and the Kiyo plasma etch system is likely involved in etching after the dry resist development stage. These tools collectively enable Lam’s dry resist process to achieve improved resolution, defect reduction, and cost efficiency in advanced EUV lithography.

The patent US20220020584A1, filed by Lam Research Corporation, describes an innovative dry development process for EUV photoresists, which eliminates the need for traditional wet chemical development methods. The patent details a dry resist system deposited via vapor-phase precursors, forming a highly uniform, single-component material that enhances EUV photon absorption and sensitivity. The dry development process selectively removes unexposed resist regions using plasma-based or plasma-free chemical methods, significantly reducing line collapse and defectivity while improving resolution at sub-2nm nodes. By integrating dry resist deposition, EUV exposure, and dry development into a single cluster tool, the patented technology enables scalable, high-volume EUV manufacturing with lower chemical consumption and improved process sustainability, positioning it as a key enabler for High-NA EUV lithography.

Lam Research’s dry resist technology represents a significant development in EUV lithography by addressing key challenges in stochastic defectivity, process cost, and sustainability. Its qualification for 2nm logic and advanced DRAM manufacturing confirms its readiness for high-volume production. By utilizing ALD for precise resist deposition and securing a stable precursor supply through partnerships with Entegris and Gelest, Lam has established a strong foundation for scaling the technology. 

Sources:

Lam Research Press Release on DRAM Adoption (Jan 2025): Lam Research

imec Qualification of Dry Resist for 2nm Logic (Jan 2025): imec

Entegris and Gelest Collaboration Announcement (July 2022): Entegris

Overview of Dry Resist ALD and Precursor Chemistry: SemiAnalysis

ASML High-NA EUV Roadmap and Implications for Dry Resist: ASML

Lam Reserach patent application US20220020584A1: US20220020584A1.pdf

Game-Changing ALD Breakthrough: KJLC Achieves First Scandium Nitride PEALD Process

Revolutionizing Atomic Layer Deposition: Kurt J. Lesker Company's Groundbreaking ALD Publication

January 08, 2025 | By KJLC Innovate 

In the ever-evolving world of semiconductor technology, innovation is the key to staying ahead. At Kurt J. Lesker Company, we are proud to announce a groundbreaking achievement that promises to revolutionize the field of Atomic Layer Deposition (ALD). Our latest publication, featuring the patented Precursor Focusing Technique (PFT) and Ultra-High Purity (UHP) process capability, marks a significant milestone in our commitment to advancing next-generation applications.

The First of Its Kind: Scandium Nitride by PEALD

For the first time, scandium nitride (ScN) has been successfully deposited using plasma-enhanced atomic layer deposition (PEALD) on silicon, sapphire, and magnesium oxide substrates under UHP conditions. This innovative process utilizes a new scandium precursor, bis(ethylcyclopentadienyl)scandium-chloride [ClSc(EtCp)2], combined with N2-H2 plasma species, allowing for the deposition of high-quality ScN films at relatively low temperatures (200−300°C).

Why This Publication is a Game-Changer

The significance of this publication lies in its potential to transform various advanced electronic applications. The ScN films produced by this process exhibit high crystalline quality and excellent electrical properties, with high mobility and low resistivity. These characteristics make them suitable for a wide range of applications, including thermoelectric devices and as an interlayer for epitaxial gallium nitride (GaN) growth.

Moreover, the ability to conformally coat high aspect ratio (HAR) structures is particularly valuable for applications in 3D embedded memory and piezoelectric microelectromechanical systems (piezoMEMS). Traditional sputtering techniques are not suitable for these applications involving complex 3D architectures, making this new ALD process a significant advancement.

The Commercial Relevance of ScN

Scandium nitride is commercially relevant primarily because it forms a solid solution with aluminum nitride (AlN), resulting in aluminum scandium nitride (Al1-xScxN), which enables ferroelectric switching. Al1-xScxN thin films are traditionally deposited via reactive magnetron sputtering, which yields highly c-axis oriented columnar grains. However, sputtering is not suitable for coating high-aspect ratio (HAR), vertically layered structures such as those desired for use in 3D embedded memory.

Recently, there have been several reports of piezoelectric AlN grown by atomic layer deposition (ALD) techniques that have shown promising crystalline quality and properties. However, there are no reports of ALD Al1-xScxN, principally because there are no reported ALD processes for ScN. This publication addresses this gap, providing a new method for depositing high-quality ScN films.

Looking Ahead

As KJLC continues to push the boundaries of ALD technology, we are excited about the possibilities our new research and development opens up. From thermoelectrics to applications involving high-aspect ratio (HAR) architectures such as 3D embedded memory and piezoMEMS technology, the high crystalline and electrical quality demonstrated here for ScN by PEALD techniques is just the beginning.

Sources:

https://www.lesker.com/blog/revolutionizing-ald-kjlcs-groundbreaking-ald-publication - Blog article

https://www.lesker.com/newweb/vacuum_systems/pdf/jva24-le-gl2025-00618.pdf - Paper Download

Kalpana Systems Unveils Roll-to-Roll Spatial ALD Tools for Solar, Batteries, and Packaging

Kalpana Systems, a Dutch thin film equipment manufacturer, has launched roll-to-roll spatial atomic layer deposition (sALD) tools, targeting industries such as solar PV, organic light-emitting diodes, batteries, and packaging. The technology focuses on depositing high-quality functional thin layers with atomic precision without causing sputter damage, with initial applications in barrier layer deposition. Since its founding in 2021, the company has developed its first operational machine, raising €3.5 million to transition from prototype to commercial production. The sALD technology supports high throughput industrial processes, enabling deposition of multiple layers with web speeds up to 10 m/min and is designed for integration with other deposition techniques. Two models, the K300 and K600, cater to different market needs, with specifications optimized for flexible electronics, solar cells, and high-speed applications like batteries and packaging.

The sALD equipment addresses stability and durability challenges faced by producers of perovskite and organic solar cells, offering cost-effective encapsulation methods. Both K300 and K600 models can process flexible substrates and are programmable for various operational parameters, making them versatile across roll-to-roll production processes. With lead times of 9–12 months, Kalpana Systems offers customizable customer onboarding support. Backed by investors such as Fairtree Elevant Ventures and SIG InnoVentures, the company emphasizes the uniqueness of its roll-to-roll technology in delivering high volume, rapid production, and wide market adoption. These innovations position Kalpana Systems as a competitive player in thin film deposition, advancing the development of efficient and scalable manufacturing solutions.

Kalpana Systems, founded in 2021 and headquartered in Delft, Netherlands, specializes in high-throughput spatial Atomic Layer Deposition (sALD) technology for thin film coatings on flexible substrates.Their innovative Superspatial ALD technology enables cost-effective production of thin films, facilitating the transition from technological promise to commercial application. The company's solutions are designed to advance sectors such as solid-state batteries, environmentally friendly packaging, and perovskite solar cells.

In July 2024, Kalpana Systems secured €3.5 million in a Series A funding round led by Fairtree Elevant Ventures, SIG InnoVentures, and the Energy Transition Fund Rotterdam.This investment aims to accelerate the development and commercialization of their sALD technology, positioning the company to meet the growing demand for advanced thin film deposition solutions across various industries.

Skytech Inc. Poised for Record Growth with Advanced ALD and Etching Innovation

Skytech Inc., a leading Taiwanese semiconductor equipment manufacturer, is forecasting a milestone year in 2025, with anticipated revenue growth exceeding 20% year-on-year. The surge is driven by robust demand for advanced chip manufacturing and packaging solutions, including atomic layer deposition (ALD) equipment and chip-on-wafer-on-substrate technologies. Skytech's innovative offerings, such as its highly customizable ALD systems and newly introduced etching solutions like Descum and Plasma Polish, are solidifying its position in the global semiconductor industry. With expanded clean room facilities and a strong product portfolio, Skytech continues to lead in cutting-edge semiconductor technologies while navigating geopolitical challenges with resilience.

Skytech Inc, a Taiwanese semiconductor equipment manufacturer, forecasts at least 20% year-on-year revenue growth in 2025, driven by strong demand for advanced chip manufacturing and new advanced packaging equipment. The company is expanding its clean room facilities in Hsinchu County to meet customer demand and has secured significant orders for atomic layer deposition equipment and tools used in advanced packaging technology, including chip-on-wafer-on-substrate solutions. In the first 10 months of 2024, Skytech’s revenue grew 18.33% to NT$1.69 billion, with net profit rising 64.15% year-on-year to NT$261 million. Semiconductor equipment contributes 50% of Skytech's revenue, while components and parts supply make up the remainder. With a 30% exposure to the Chinese market, Skytech is monitoring geopolitical tensions but remains unaffected by export restrictions.

Skytech develops and manufactures Atomic Layer Deposition (ALD) equipment. In 2019, the company designed its first ALD machine, named Atomila, marking its entry into the ALD equipment market.  Skytech's ALD systems are equipped with six chamber positions and are highly integrated with Equipment Front End Module systems. These systems offer customizable chamber configurations based on customer requirements and include options for pre-treatment or post-treatment of ALD depositions. Depending on temperature and plasma damage concerns, customers can choose between Thermal-ALD or Plasma-Enhanced ALD (PE-ALD) processes. The equipment features a patented gas inlet design and showerhead system to ensure excellent uniformity. Additionally, an optional automatic pick-and-place tool enables coating of different wafer sizes on a 12-inch platform, supporting fab automation.  In 2021, Skytech's ALD equipment was verified and adopted by Epistar, contributing to the commercialization of LED technologies.  

Skytech's ALD systems feature six chamber positions and are highly integrated with Equipment Front End Module (EFEM) for advanced automation. The systems offer customizable chamber configurations tailored to customer requirements and include optional treatment chambers for effective pre-treatment or post-treatment of ALD depositions. Users can choose between Thermal-ALD or Plasma-Enhanced ALD (PE-ALD) processes, depending on temperature and plasma damage concerns. The equipment is equipped with SECS/GEM protocols for seamless fab automation and incorporates a patented gas inlet design and showerhead system to ensure excellent uniformity. Additionally, an optional automatic pick-and-place tool enables coating of different wafer sizes on a 12-inch platform, further enhancing its suitability for automated semiconductor manufacturing.

Skytech's Powder ALD Tool is designed to extend the lifespan and enhance the stability of quantum dots (QDs) by applying Al₂O₃ passivation to protect against oxygen, moisture, and heat. Leveraging Atomic Layer Deposition (ALD), the tool provides sub-nanometer precision and highly conformal coatings under gentle conditions, making it ideal for QD thin films. The tool features an optional ozone generator for diverse oxidation sources, a specialized flow field design for improved powder coating, a uniform chamber temperature maintained by a unique heater design, and support for three sets of precursor/co-precursor pipelines. It is specifically tailored for effective powder coating, ensuring optimal protection for QDs.

In 2023, the company introduced etching systems such as Descum and Plasma Polish, expanding its product line to meet market demands.  These etching solutions are designed to support various semiconductor manufacturing processes, enhancing Skytech's capabilities in the semiconductor equipment industry. 

Sources:

Skytech expects revenue to increase to all-time high - Taipei Times

Jusung Engineering Posts Stellar Q2 Recovery with 207% Sales Surge, Driven by Semiconductor Market Rebound

Jusung Engineering reported a robust financial recovery in the second quarter of 2024, with sales soaring by 207% to 97.3 billion won ($72.0 million) compared to the same period last year, and an operating profit margin of 37%. This turnaround follows a challenging first quarter and is driven by increased orders and deliveries of semiconductor equipment, including a significant contract with SK Hynix for DRAM manufacturing in China. The company's expertise in Atomic Layer Deposition (ALD) technology and its expansion into OLED and solar power sectors position it well for continued growth as the semiconductor market rebounds.

Sources:

Jusung Engineering Reports Robust Q2 Results with 207% Sales Growth - Businesskorea

ACM Research Advances in ALD with Ultra FnA Furnace System for Semiconductor Manufacturing

ACM Research, a US company specializing in wafer cleaning equipment for the semiconductor industry, presents a strong growth opportunity. The company beat Q2 estimates, raised its fiscal year guidance, and is well-positioned to benefit from the expected significant growth in the wafer cleaning equipment market, particularly in China. ACM Research's competitive advantages include high investment in R&D and the ability to provide highly customized solutions. 

The Ultra FnA Furnace System by ACM Research is designed for the precise and uniform deposition of ultra-thin films using thermal Atomic Layer Deposition (ALD), which is essential for advanced integrated circuits (ICs) and compound semiconductor manufacturing as logic nodes shrink. It effectively deposits silicon nitride (SiN) and silicon carbide nitride (SiCN) on high aspect ratio 3D structures, such as FinFETs and nanosheets, ensuring good step coverage and uniformity across wafers. The system boasts superior process control through its innovative hardware and proprietary algorithms, offering high-throughput batch processing, cost-effectiveness, and customization for various advanced semiconductor processes, with the capability to process up to 100 wafers at a time.

ACM Research Advances in ALD with Ultra FnA Furnace 300 mm System for Semiconductor Manufacturing

About ACM Research

ACM Research offers a comprehensive portfolio of tools designed to support various semiconductor manufacturing applications, including ICs, compound semiconductors, wafer-level packaging, and wafer manufacturing. Their advanced product range includes solutions for multiple processing steps such as wet cleaning, electroplating, thermal deposition, ALD, and more. Known for delivering customized, high-performance technology that enhances productivity and efficiency, ACMR is committed to meeting the diverse needs of high-volume manufacturing with a low cost of ownership. With a strong IP portfolio and a global presence, ACMR leverages its extensive industry expertise and international support network to provide innovative solutions and world-class service to customers across Asia, North America, and Europe. Founded in California in 1998, the company operates manufacturing and support facilities in China and South Korea.

Sources:

Ultra FnA ALD Furnace System - ACM Research, Inc.

ACM Research: A Promising Semiconductor Growth Opportunity Outpacing Risks (NASDAQ:ACMR) | Seeking Alpha

Jusung Engineering to Spin Off Semiconductor Business, Aiming for Market Revaluation and Strategic Growth

Jusung Engineering, a a first in Korea’s chipmaking equipment industry, has announced a significant restructuring aimed at enhancing its market valuation and navigating geopolitical risks. The company will spin off its highly successful semiconductor division into a new entity, marking a strategic move to unlock greater value for its shareholders and position itself for future growth.

Chairman Hwang Chul-ju highlighted the undervaluation of Jusung despite its proprietary technologies and leading market position. By creating a new entity for its semiconductor business, Jusung aims to elevate its market cap, which currently lags behind international competitors. The new semiconductor entity, tentatively named Jusung Engineering, will operate independently, allowing it to focus solely on expanding its technological capabilities and market presence.

The spin-off comes as Jusung's semiconductor division continues to excel with its advanced film deposition technologies, including selective semi-spheric silicon deposition and atomic layer deposition (ALD). These technologies are pivotal in the production of DRAM memory, NAND flash, and logic chips. As the demand for more integrated and smaller semiconductor devices grows, Jusung's ALD equipment is set to become increasingly crucial. Additionally, Jusung’s poly etchers, applicable across various semiconductor products, will play a significant role in diversifying the company’s offerings.

Despite achieving annual sales of 200 billion won ($146 million) and holding a market cap of 1.6 trillion won, Jusung's valuation remains significantly lower than its global peers. For instance, Dutch competitor ASM boasts a market cap of 47.3 trillion won. The spin-off is expected to narrow this gap, potentially achieving comparable sales records within five years. 

The decision also aims to mitigate risks from the ongoing US-China rivalry. By separating the semiconductor business, Jusung can better shield its other divisions, including display and solar panel equipment, from potential geopolitical fallout. This strategic insulation ensures that the company’s diverse operations remain resilient in the face of international tensions.

There is speculation about Hwang Eun-seok, the chairman’s son, taking the helm of the new semiconductor entity. With a doctorate in material science and experience at Samsung Semiconductors, Eun-seok is well-prepared for leadership, though Chairman Hwang emphasizes that any succession will be merit-based.

Jusung Engineering's spin-off of its semiconductor business represents a bold move to enhance its market valuation and strategically position itself for sustained growth. By creating a focused, independent entity, Jusung aims to capitalize on its technological strengths and navigate the complexities of the global semiconductor market more effectively. This restructuring is set to unlock new opportunities and reinforce Jusung's standing as a key player in the tech industry.

Sources: Jusung, Undervalued no more: Jusung Engineering to spin off chip business (naver.com)

ASM a revenue of €639 million Q12024 - driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

Here are the key points from ASM International NV's financial results for the first quarter of 2024:

The company reported a revenue of €639 million, at the upper end of their guidance, driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

The foundry and memory segments were the leading contributors to revenue. While the combined logic/foundry segment saw a decline year-over-year, it improved from the previous quarter. The automotive semiconductor market showed weakness, whereas the memory market is showing signs of recovery.

• Gross margin increased to 52.9%, largely due to strong sales performance in the Chinese market.
• New orders reached €698 million, marking a 10% increase from the previous year, mainly driven by the foundry sector. The company expects continued demand for gate-all-around technology, with significant orders anticipated in the second half of the year.
• Despite a slowdown in certain segments like power/analog/wafer, ASM International maintains a strong financial position with a cash reserve of €720 million at the end of the quarter. Sales in China are expected to remain robust.

Kokusai Electric Showcased Batch ALD Technology for 40-28nm Nodes at SEMICON China 2024

At SEMICON China 2024, Kokusai Electric Corporation emphasized its strengths in atomic layer deposition (ALD) technology. The company showcased its batch-type ALD systems, which are particularly adept at achieving high-quality, uniform film deposition on multiple wafers simultaneously. This technology ensures excellent film thickness control and good step coverage, crucial for advanced semiconductor manufacturing. As the Chinese market increasingly transitions from chemical vapor deposition (CVD) to ALD due to its precision, Kokusai is poised to meet this rising demand, especially in fields like 3D stacking and miniaturization.

Kokusai highlighted its ALD technology specifically for mature semiconductor technology nodes in the 40 to 28nm range at SEMICON China 2024. This focus addresses the growing demand for precise film quality in these specific nodes within the Chinese market.

Source: Kokusai Electric Zeroes in on Film Quality Improvement | AEI (dempa.net)

ASM International: Spearheading Semiconductor Innovation in ALD, Epitaxy, and CVD Markets

ASM International N.V. (Euronext Amsterdam: ASM) yesterday reported its fourth quarter 2023 operating results (unaudited). Double-digit full-year revenue growth, outperforming softer WFE market in 2023

Investor presentation: 2023_q4_investor-presentation.pdf (asm.com)

“2023 was another successful year for ASM. Sales increased by 13% at constant currencies, despite softening market conditions, and marking the seventh consecutive year of double-digit growth.” said Benjamin Loh, CEO of ASM. “Revenue in Q4 2023 amounted to €633 million, in line with our guidance of €600-640 million and down compared to the level in Q4 2022. Revenue in the quarter was supported by strong sales in the power/analog/ wafer segment. Bookings at €678 million were slightly better than our expectation and were driven by GAA pilot- line orders and continued strength in China demand.

ASM's Leadership in the Growing ALD Market

According to ASM, the single wafer Atomic Layer Deposition (ALD) market is experiencing significant growth, with projections indicating an increase from $2.6 billion in 2022 to a range of $4.2 billion to $5.0 billion by 2027. This growth, characterized by a Compound Annual Growth Rate (CAGR) of 10-14% from 2022 to 2027, underscores the expanding role of ALD technology in semiconductor manufacturing. ASM International, a key player in the semiconductor industry, holds a dominant position in this market, commanding a share of over 55% throughout the forecast period.

Please note that this market assessment, most probably originally from TechInsights (prev. VLSI Research) does not include Large Batch furnace ALD, which historically have been about 30% of the total 300 mm ALD equipment market. The leaders in this segment are Tokyo Electron followed by Kokusai and ASM chose not to compete with its A412 ALD product line.

Driving Forces Behind ALD Market Expansion

The expansion of the ALD market is propelled by a series of technological advancements and increasing demands within the semiconductor sector. Key factors contributing to this growth include the industry's shift towards Gate-All-Around (GAA) technology, the necessity for advanced high-k gate dielectrics, and the precision required for threshold voltage tuning. Additionally, the development of sacrificial layers and the use of high aspect ratio Through-Silicon Vias (TSVs) are critical in advancing semiconductor manufacturing techniques. The application of metals and the adoption of selective ALD processes further accentuate the importance of ALD technology in modern semiconductor fabrication.

ASM's Strategic Positioning and Market Opportunities

ASM is well-positioned to capitalize on the opportunities presented by the burgeoning ALD market. The company's strategic emphasis on innovation, coupled with its comprehensive product portfolio, positions ASM as a frontrunner in meeting the evolving needs of the logic/foundry and memory segments of the semiconductor industry. The transition to advanced manufacturing technologies, such as GAA and high-k metal gate applications, presents significant growth avenues for ALD, with ASM at the forefront of this technological evolution.

To be more specific, the transition to GAA technology and the expansion in FinFET applications are set to significantly increase ASM's served available market by approximately US$400 million for every 100,000 wafer starts per month (WSPM). According to ASM, the equipment orders started to come in in the 2nd half of 2023. We can assume that this are orders from Samsung, TSMC and Intel. It is however about peculiar since Samsung had 3 nm GAA going already with yield in August 2023 and ASM is describing it as GAA pilot lines. Anyhow, come 2028 when all leading foundries including Rapidus in Japan are up and running GAAFETs, this additional market will be + USD 1.5 B as compared to if it would have been "only" FinFET technology - according to my back of the envelope calculations. For a company like ASM, with just below USD 3 B (2.6 B EUR) annual Revenue 2023 this is a huge thing. If this is not enough to go woah - add to that the GAAFET market is an upwards moving target and will continue to grow and looking ahead stacking of NMOS/PMOS will drive further demand for this type of ALD and Epi processes.

Expansion into the Epitaxy and CVD Markets

The Silicon Epitaxy (Si epi) market is also on a growth trajectory, with forecasts suggesting it will reach between $2.3 billion and $2.9 billion by 2027. ASM aims for a market share target of over 30%, focusing on both leading-edge and non-leading-edge segments. The leading-edge growth is driven by transitions to GAA technology and advancements in high-performance DRAM, while the non-leading-edge growth is buoyed by wafer power analog and strong momentum from ASM's Intrepid ESA. The epitaxy market is expected to see a Compound Annual Growth Rate (CAGR) of 3-8% from 2022 to 2027, with the leading-edge segment outpacing the overall market with a CAGR of 10-15%.

Regarding the SiC market, the investor presentation highlighted significant growth in power/analog/wafer revenue, almost doubling, primarily driven by robust demand in China. This growth was positively impacted by the consolidation of LPE (SiC Epitaxy), with sales comfortably exceeding the target of more than €130 million in 2023. This indicates ASM's strong performance in the SiC market and its successful integration and expansion in SiC epitaxy, aligning with the broader industry trend towards more advanced and efficient semiconductor materials.

Chemical Vapor Deposition (CVD) technology is another area of focus for ASM, particularly in the context of transitioning to new materials like Molybdenum, which is replacing traditional materials such as CVD Tungsten and PVD Copper in interconnect applications. This shift is indicative of the evolving needs within the semiconductor manufacturing process and highlights ASM's adaptability to changing market dynamics.

In summary, ASM's strategic initiatives in ALD, Epitaxy, and CVD technologies underscore the company's commitment to innovation and leadership within the semiconductor equipment market. Through a combination of market foresight, technological prowess, and strategic investments, ASM is well-positioned to capitalize on the growth opportunities presented by the evolving semiconductor landscape. 

Significant Investment in ALD Technology for MicroLED & AR: Oxford Instruments' Pioneering Role

Oxford Instruments, a renowned name in the realm of technology, has recently made a significant contribution to the advancement of MicroLED and Augmented Reality (AR) devices. The company has supplied its state-of-the-art Atomic Layer Deposition (ALD) technology to a leading UK manufacturer. This move is set to revolutionize the way we experience consumer-immersive reality products and display devices.

The Rise of MicroLED and AR

The demand for wearable devices with compact form factors and high-definition displays is skyrocketing. This trend is driving extensive research and development in the industry. MicroLEDs stand out in this arena for their ability to offer incredibly small die pitch sizes (less than 10 µm), enabling the miniaturization of wearable display devices without compromising image resolution. However, as pitch sizes shrink, the challenges in manufacturing increase, particularly regarding the damage caused during mesa formation and isolation steps. This damage can significantly impede device performance.

Oxford Instruments' Breakthrough with Plasma ALD

At the 2023 International Conference on Nitride Semiconductors (ICNS) in Fukuoka, Japan, the spotlight was on Plasma ALD technology, provided by Oxford Instruments. This technology has been hailed for its ability to mitigate damage and substantially boost external quantum efficiency – a critical measure of material performance. The Plasma ALD technology from Oxford Instruments, especially their high-K passivation solution, is optimized for smaller dies, enhancing performance in devices like head-mounted displays for virtual reality and smartwatches.

Oxford Instruments' ASP tool for PEALD offers precise, plasma-enhanced thin-film deposition, ideal for semiconductor, photonics, and microLED applications.

Klaas Wisniewski, Oxford Instruments' Strategic Business Development Director, expressed excitement about their Plasma ALD technology's growing market presence. "Our low-damage Plasma ALD technology, especially on our 200 mm capable platform, has been instrumental in doubling the external quantum efficiency for some of our customers at ICNS," said Wisniewski.

Looking Forward: Photonics West 2024

Oxford Instruments is not resting on its laurels. As a leader in compound semiconductor processing equipment, the company is set to participate in Photonics West 2024 in San Francisco. There, Oxford Instruments will showcase its latest optoelectronics processes for augmented, virtual, and mixed reality, as well as quantum and data transfer applications critical for AI and machine learning. This event will be an excellent opportunity for industry professionals to learn how Oxford Instruments' etch, deposition, and Ion Beam process solutions can enhance their projects, ensuring higher efficiency and lower costs.

In conclusion, Oxford Instruments' investment in ALD technology for MicroLED and AR is a game changer, marking a significant step forward in the evolution of consumer electronics and immersive reality experiences.

NCD supplied repeated ALD equipment for special protective coating

NCD Co., Ltd. has again supplied large-scale productive ALD equipment to a Korean customer. It is for special coating parts used in semiconductor equipment to protect from corrosion and plasma arcing. This contracted equipment is the improved Lucida GSH Series ALD, which is capable of coating more and heavier products at once than the existing equipment. So the customer is able to obtain the greater increased productivity and reduced coating costs.

As semiconductor devices become smaller and more integrated, particles and byproducts that were not a problem before can significantly affect device performance, so the cleaning cycle and life time of parts used in semiconductor equipment are becoming shorter.

Lucida GSH Series ALD

Therefore, atomic layer deposition protective coating on parts can be a very effective solution, and high-quality, uniform atomic layer coating can achieve the effect of increasing the usage time of expensive parts in semiconductor equipment without cleaning and replacement.

Previously, atomic layer deposition protective coating was widely applied to expensive parts such as showerheads and ESCs, but recently, it has been applied to various semiconductor equipment parts with complex gas paths, quartz products with complicated shapes, and high-purity precursor canisters that require the lowest impurity control. The scope of application is gradually increasing so we will look forward to steady and continued expansion of products and markets in this application field.

This repeated contract confirms once again the excellence of NCD's industrial atomic layer deposition technology and equipment to its customers, and it showed NCD to have occupied the leader on the gradually expanding market of atomic layer deposition equipment for part protection coating. NCD will continue to pioneer new atomic layer deposition markets based on its best technology and customer trust.

ASM International Announces $300M Expansion in Arizona, Boosted by Dutch-U.S. Collaboration with Prime Minister Mark Rutte's Support

ASM International N.V. is set to expand its U.S. operations with a €300 million investment in a new facility in Scottsdale, Arizona. This expansion, covering more than 20 acres, aims to bolster their research, technology development, and manufacturing capabilities in the semiconductor industry. The state-of-the-art site, spanning 250,000 square feet, will host various functions, emphasizing renewable energy and sustainability.

A rendering of the new ASM HQ (source ASM America)

This move marks a significant step in reinforcing Arizona's position as a hub for semiconductor innovation and highlights the strong Arizona-Netherlands partnership. Notably, Mark Rutte, Prime Minister of the Netherlands, emphasized the importance of this expansion in strengthening cross-border collaborations and the global semiconductor value chain. The initiative is viewed as pivotal in fostering Dutch-U.S. partnerships and propelling advancements in the industry.

“Arizona and the U.S. are valuable partners in the Netherlands’ mission to co-create solutions that promote innovation and partnerships in the global semiconductor value chain,” said Mark Rutte, Prime Minister of the Netherlands. “It is through these types of cross-border collaborations that we are shaping the future of advancements in this growing industry.”

The new facility will create approximately 500 new jobs over six years, focusing on engineering and research roles. ASM's commitment to sustainability is evident in its plans for LEED certification and water reuse programs. Additionally, the company has formed partnerships with local organizations for environmental conservation efforts, showcasing its dedication to community and environmental stewardship. This expansion by ASM International is set to significantly enhance semiconductor technology and innovation, highlighting the growing synergy between the U.S. and the Netherlands in this vital sector.

Source:

Press releases | ASM

Launch of the Oxford Instruments Innovation Centre: Advancing Scientific Research and Collaboration

The Oxford Instruments Innovation Centre, a state-of-the-art facility, has been launched at its High Wycombe site. This Centre consolidates Oxford Instruments' analytical innovations, aligning with its mission of fostering a greener, healthier, more connected society. The inauguration welcomed dignitaries like Countess Howe, Lord-Lieutenant of Buckinghamshire, and Cllr. Paul Turner, Mayor of High Wycombe, alongside prominent figures from academia and industry. Dr. Ian Wilcock, Managing Director, led the opening, showcasing the Centre's role in advancing scientific research in various fields. The facility, a collaboration hub, allows access to cutting-edge technology and expertise. Oxford Instruments, a pioneer since 1959 and a significant contributor to Nobel-prize winning research, continues to impact science, particularly in material analysis, underlining its global technological leadership.

Source: Oxford Instruments Launches Innovation Centre - Oxford Instruments (oxinst.com)

Congratulations to Jusung Engineering on 30 Years of Pioneering Innovation and Market Leadership in ALD, Semiconductor, Display, and Solar Technologies!

Jusung Engineering, celebrating its 30th anniversary, is a leader in semiconductors, displays, and solar equipment. Founded in 1993, the company has seen considerable growth through innovation, achieving record sales and operating profits last year. It specializes in semiconductor equipment for memory and non-memory sectors, leveraging advanced ALD technology. In displays, Jusung is diversifying equipment for various panel sizes, while in solar, it's innovating with high-efficiency solar cells. The company is investing in future growth, with new R&D and manufacturing facilities, focusing on technological independence. It holds over 3,000 patents, with 65% of its workforce in R&D, investing 15-20% of sales in technology development. The CEO attributes their success to relentless innovation and a unique path, with plans to maintain leadership in future technologies and expand into global markets. Despite recent challenges, Jusung remains optimistic, prioritizing innovation and market creation.

The Jusung Engineering headquarters in Gwangju, Korea 출처 : Businesskorea (https://www.businesskorea.co.kr)

Fullarticle and interview:

Jusung Engineering Leading in Semiconductor, Display, Solar by Innovating with Atomic Layer Deposition - Businesskorea

Kokusai Electric's Stellar Tokyo IPO: A Surge in Stock, High Hopes for the Future

Kokusai Electric's stock rose 28% in its Tokyo debut after KKR sold its shares for $724 million, marking Japan's largest IPO in five years. Closing at 2,350 yen, Kokusai's valuation reached $3.61 billion. This was the biggest Tokyo listing since SoftBank Corp. in 2018. KKR reduced its stake from 73.2% to 47.7%. Analysts noted a challenging market for chip-related stocks but anticipate a rebound for Kokusai. The company specializes in machines for silicon wafer films, with major clients like Samsung. Despite a predicted profit drop, Kokusai's President sees growth potential by 2025. KKR's previous sale attempt to Applied Materials was unsuccessful. The IPO saw huge interest, with foreign investors oversubscribing by over 10 times.

Source: Kokusai Electric shares jump 28% in Tokyo debut - Nikkei Asia

Kokusai Electric's Upcoming IPO: A Strategic Move in the Booming Semiconductor Market

Kokusai Electric is set to go public on the Tokyo Stock Exchange on October 25th, with an indicative share price of 1,890 yen per share. The IPO aims to raise 111.2 billion yen ($749.88 million) to fund research investment in the chipmaking equipment market. This move also serves as a partial exit for KKR, which previously purchased Hitachi's electronic equipment unit in 2017 and later spun off Kokusai.

In 2019, KKR attempted to sell Kokusai to Applied Materials for $3.5 billion, but the deal fell through due to regulatory hurdles in China. Applied Materials subsequently acquired a 15% shareholding in Kokusai. Kokusai Electric specializes in semiconductor manufacturing equipment, particularly in Atomic Layer Deposition (ALD) technology, with a strong market position, including a 23% share of the global ALD equipment market in 2020.

Kokusai Electric's ALD equipment portfolio includes products like TSURUGI-C²® for 300mm wafers and VERTRON® Revolution for 200mm wafers, known for their high performance and productivity. The company's main customers for ALD equipment include Samsung, SK Hynix, Micron, and Intel. Kokusai Electric's IPO is scheduled for September 23, 2023.