AlixLabs Secures Notice of Allowance for US Patent for Innovative Semiconductor Manufacturing Technology

Swedish semiconductor startup’s APS™ patent portfolio continues to grow with xth U.S. patent, marking the company’s 10th pending global patent.

Stockholm, Sweden – May 6th, 2025 – AlixLabs is excited to announce that the US Patent and Trademark Office has issued the notice of allowance for the company’s latest patent application, US20250087487A1, titled Formation of an array of nanostructures. This milestone marks the next step in AlixLabs’ commitment to advancing semiconductor manufacturing technologies.

Internally referred to as the “Tetris” patent, in honor of Alexey Pajitnov, the new patent integrates self-aligned double patterning (SADP) with atomic layer etching (ALE)-based pitch splitting (APS™) technology. This innovative approach, being industrialized by AlixLabs since its founding in 2019, combines elements of both classical and leading-edge techniques to deliver superior performance for semiconductor manufacturing.

The invention arose from AlixLabs’ efforts to develop a process for precise sidewall angle control in APS™, a key component in silicon-based processes. By leveraging plasma etch process selectivity and combining features from complex plasma processes, AlixLabs has pioneered a method that blends the traditional SADP process with the advanced APS technology.

This allows the company to utilize mature industrial technologies while benefiting from the advanced control and improved performance of cyclic processes and topographical selectivity. As a result, AlixLabs’ solution offers semiconductor manufacturers an enhanced ability to address the challenges of patterning at sub-5 nm nodes.

This breakthrough is significant for the integration of APS™ technology into existing semiconductor production workflows, preserving the use of existing Process Design Kits (PDKs) which are essential tools for chip designers. By doing so, it reduces the barrier for APS adoption in high-volume manufacturing (HVM), easing the transition to next-generation semiconductor technologies.

The patented innovation provides semiconductor manufacturers with greater flexibility, offering a new way to fine-tune the APS™ process to meet the needs to cut capital and operational expenditure (CapEx and OpEx) as well as emissions for customers at advanced technology nodes, while allowing for broader compatibility with different materials. This new method further strengthens AlixLabs’ core APS™ patent portfolio, positioning the company as a leading enabler of next-generation semiconductor manufacturing.

Moreover, this invention not only supports the development of leading-edge logic, memory, and photonics but also simplifies the semiconductor manufacturing process by reducing CapEx and OpEx for semiconductor fabs.

“We remain committed to advancing semiconductor manufacturing with innovations that significantly enhance the precision, flexibility, and efficiency of our technologies,” commented Dmitry Suyatin, co-founder and CTO of AlixLabs. “This patent represents a critical step forward in our mission to drive the next generation of semiconductor processes and further solidify our position as a leader in the field.”

AlixLabs Secures Notice of Allowance for US Patent for Innovative Semiconductor Manufacturing Technology – AlixLabs

Tokyo Electron Delivers Record FY2025 Results Amid AI Boom, Eyes Growth Through CVD Innovation and Geopolitical Resilience

Tokyo Electron (TEL) achieved a record-breaking financial year in FY2025, with strong top- and bottom-line growth driven by robust global demand for advanced semiconductor equipment. Net sales rose by 32.8% year-on-year to approximately ¥2.43 trillion (around $15.7 billion USD), marking the highest in the company's history. Operating profit surged to ¥697.3 billion (about $4.5 billion USD), supported by an improved operating margin of 28.7%. Growth was underpinned by increased investment in leading-edge logic and memory, particularly High Bandwidth Memory (HBM) and advanced DRAM nodes, where TEL maintained or expanded market share through key Process of Record (POR) wins in etch and wafer bonding technologies. Revenue contributions diversified geographically, with notable gains in South Korea and Taiwan, even as China remained a key market. TEL also demonstrated strong cash flow, increased its R&D and capital investments, and returned significant value to shareholders through dividends and buybacks. Looking ahead, TEL forecasts continued growth in FY2026, positioning itself to capitalise on accelerating AI, 2nm logic, and heterogeneous integration trends.

Tokyo Electron TEL has demonstrated strong financial performance and strategic market expansion through FY2025, according to their investor presentation dated April 30, 2025. Their net sales, gross profit, operating profit, and net income have all reached record highs, signaling both operational efficiency and favorable market conditions.

LINK: Tokyo Electron Limited 2025 Q4 - Results - Earnings Call Presentation (OTCMKTS:TOELY) | Seeking Alpha

Tokyo Electron's Q4 FY2025 earnings call highlighted strong financial performance and an optimistic forward outlook amid geopolitical uncertainties. Despite global concerns around US tariffs and export controls—particularly in China, which saw its WFE market share fall to 35%—TEL stated that it has not observed any significant changes in customer investment sentiment or competitive dynamics. The company reaffirmed its strategy of focusing on long-term innovation rather than short-term regulatory shifts, underscoring its commitment to developing higher-productivity tools to offset potential external headwinds. Looking ahead, TEL forecasts continued double-digit WFE market growth into calendar 2026, driven by AI infrastructure demand, 2nm logic, and HBM scaling. The company plans record-high investments of ¥300 billion in R&D and ¥240 billion in CapEx for FY2026, reflecting confidence in sustained momentum across DRAM, advanced logic, and packaging technologies. TEL aims to expand global market share and reach ambitious mid-term goals, including over ¥1 trillion in operating profit and 35%+ OPM, by capitalising on technology transitions such as GAA, backside PDN, and heterogeneous integration.

LINK: Tokyo Electron Limited (TOELY) Q4 2025 Earnings Call Transcript | Seeking Alpha

Revenue and Profitability Growth:

Net sales increased significantly from ¥1,399.1 billion in FY2021 to ¥2,431.5 billion in FY2025, a 74% increase over four years. The gross profit also rose steadily, reaching ¥1,146.2 billion in FY2025, up from ¥564.9 billion in FY2021. Operating profit followed suit, more than doubling from ¥320.6 billion to ¥697.3 billion. These trends underscore TEL’s ability to scale profitably, with operating margins rising from 22.9% in FY2021 to 28.7% in FY2025. Return on equity (ROE) also remained strong, peaking at 37.2% in FY2022 and settling at 30.3% in FY2025, a testament to effective capital management.

Regional Sales Composition:

The revenue breakdown by region from Q1 FY2024 to Q4 FY2025 shows growing diversification. Notably, China has remained the single largest market, although its share declined from 47.4% in Q4 FY2024 to 34.3% in Q4 FY2025, reflecting a strategic balancing across geographies. South Korea, Taiwan, and North America significantly increased their contributions, with South Korea reaching ¥147.0 billion and Taiwan ¥135.8 billion in Q4 FY2025. This reflects growing demand from advanced logic and memory fabrication customers in these regions.

In FY2025, Tokyo Electron’s semiconductor production equipment (SPE) sales reached ¥1.86 trillion, driven by a sharp rise in DRAM-related investments, particularly for high-bandwidth memory (HBM), which accounted for 31% of total sales. Non-volatile memory (NAND) remained stable at 7%, while non-memory segments, including logic and foundry, continued to dominate with 62%, reflecting robust demand from both advanced and mature nodes. The overall recovery and expansion of customer investments across segments underpinned this strong performance.

Market Segment Performance

Tokyo Electron’s global market share in CY2024 demonstrates its leadership across multiple core segments of the semiconductor production equipment market. The company holds a commanding 92% share in coater/developer systems, underlining its unparalleled position in photoresist processing for advanced lithography applications. It also leads the wafer prober segment with a 38% share and maintains robust positions in key deposition categories, including 38% in CVD and 37% in oxidation/diffusion systems. In contrast, TEL’s market share in ALD stands at 16%, notably behind ASM International, highlighting an opportunity for expansion in this strategically important technology as the industry moves towards GAA and other 3D device structures. Performance in dry etch (27%), cleaning systems (21%), and wafer bonding (32%) rounds out a broadly competitive portfolio that positions TEL to effectively support ongoing advancements in scaling, heterogeneous integration, and high-performance packaging across logic, memory, and AI-related applications.

To further expand our future profit, we made steady progress in penetrating into new technology domains. Specifically, we released multiple new outstanding products contributing to the semiconductor technology innovation. For example, penetration to untapped segments such as single-wafer plasma CVD and PVD, gas cluster beam system which improves efficiency of leading-edge lithography, and laser-lift-off system to drastically decrease environmental footprint of processing. In fiscal 2025, we conducted share repurchase of about ¥150 billion in total.

- Toshiki Kawai - Representative Director, President and CEO

 

New product 2025 Episode™ single-wafer CVD platform

Episode™ 1 is Tokyo Electron's latest single-wafer CVD platform, launched in 2024 to address the challenges of advanced device scaling in logic, DRAM, and future AI processors. It supports up to eight process modules, enabling complex, uninterrupted multi-step processing. The system integrates the OPTCURE™ module for native oxide removal and ORTAS™ for titanium CVD, allowing immediate Ti deposition to minimise contact resistance in advanced interconnects. Episode™ 1 replaces traditional PVD with CVD to achieve uniform, low-resistivity films in high aspect ratio structures such as deep contact holes. With a 45% smaller footprint than its predecessor and advanced edge computing, data analytics, and environmental tracking capabilities, the system enhances fab productivity, engineer efficiency, and readiness for new materials in next-generation device manufacturing.

The TEL Episode™ 1 system shown in the image seems to feature twin or dual single-wafer process chambers, which is typical in modular CVD tools designed for high throughput. Each visible module (with two load ports per unit) likely contains two process chambers within the same footprint to maximise wafer handling efficiency and enable parallel processing—common in tools aimed at advanced logic and memory manufacturing.

Episode™ 1 offers a reduced footprint. Compared with the Triase+™ series, twice as many smaller modules can be installed in a system. With the same number of modules installed, Episode™ 1 takes up about 45% less fab space than its predecessor

LINK: Episode™ 1 Single-Wafer Deposition System for Semiconductors: Driving the Evolution of AI Semiconductors to Transform Everyday Life | Blog | Tokyo Electron Ltd.

ASM International Strengthens ALD Market Leadership Amid Strong Q1 Results, Growing GAA Adoption, and Strategic Positioning for Advanced Node Demand

ASM International’s Q1 2025 results reaffirm its leadership in Atomic Layer Deposition (ALD), a technology central to enabling advanced semiconductor nodes such as 2nm and beyond. With ALD accounting for more than half of its equipment revenue and strong customer engagement in leading-edge logic and memory, ASM is well-positioned to capitalise on rising demand driven by GAA architectures, high-bandwidth memory, and ongoing technology node transitions.

ASM International’s Q1 2025 results reinforce its leadership in ALD, a foundational technology for enabling advanced semiconductor nodes. ALD represented more than half of ASM’s equipment revenue, with the market expected to grow at a compound annual rate of 10–14% through 2027, and ASM maintaining a leading market share above 55% in the segments they compete in:

Single-Wafer ALD Tools

ASM’s flagship ALD platforms are single-wafer systems, which provide high precision, conformality, and process flexibility. These are used primarily in leading-edge logic and memory production.

• Key Platforms:

  • XP8 and XP8 QCM: High-productivity platforms supporting multiple process chambers; widely used for high-volume manufacturing.

  • Previum and Previum Pro: Previum systems incorporate an integrated epitaxial (EPI) pre-clean step that effectively removes 15–20 monolayers of native oxide from the substrate surface. This step is crucial for ensuring high-quality EPI film growth.

  • Pulsar®: Specialised for high-k dielectrics, such as hafnium oxide (HfO₂) typically used in gate stacks.

  • Eagle® XP8: Designed for advanced metal ALD (e.g. TiN, W), often used in logic and memory applications including barrier and liner layers.

ASM International’s strategic alignment with the prevailing trends in the wafer fab equipment (WFE) market and its concentrated customer base. Logic and foundry applications are set to remain the dominant segment of WFE spending through 2026, reinforcing ASM’s focus on enabling advanced nodes such as FinFET and GAA, where Epitaxy (Epi) and atomic layer deposition (ALD) are critical. The company’s FY24 revenue profile shows that its top five customers accounted for 51% of sales, while the top ten represented 70%, indicating strong relationships with leading-edge semiconductor manufacturers. These likely include TSMC, Samsung, Intel, SK hynix, and Micron—ASM’s probable top customers given their leading-edge node adoption and high ALD utilisation. Others may include GlobalFoundries, UMC, SMIC, and select IDMs. 

The industry’s shift to gate-all-around (GAA) transistor architectures at 2 nm and beyond is driving increased demand for single-wafer ALD and silicon epitaxy (Si Epi) processes, which are essential for integrating high-k dielectrics, advanced metals, and high aspect ratio features in both logic and memory devices. ASM’s deep engagement with leading-edge customers—particularly in logic/foundry and high-bandwidth memory (HBM) DRAM—has already translated into strong revenue contributions. Additionally, early tool shipments for the 1.4nm node reflect continued confidence from top-tier clients and extend ASM’s growth visibility as chipmakers prepare for more complex architectures requiring precise material deposition.

ASMI presented a robust growth trajectory of the single-wafer Atomic Layer Deposition (ALD) market, projected to reach between US$4.2 billion and US$5.0 billion by 2027, with a compound annual growth rate (CAGR) of 10–14% from 2022.

Summary from ASM International Q1 2025 Earnings Call:

1. ALD Market Outlook:
ALD continues to be a key growth driver for ASM, with equipment sales led by ALD and expectations of a strong increase in GAA (gate-all-around) related demand throughout 2025. ALD intensity is rising as leading-edge nodes (2 nm and 1.4 nm) require more deposition steps for complex 3D structures, high-k dielectrics, and metal gate stacks. ASM confirmed ongoing R&D engagement for 1.4nm and highlighted that ALD demand will further accelerate in next-gen nodes, backside power delivery, and in advanced DRAM (e.g. HBM), which increasingly adopt logic-like ALD layers. ASM remains confident in long-term ALD market growth, forecasting double-digit increases in application layers per node.

2. Trade, Tariffs, and Geopolitical Risk:
ASM addressed potential impacts from new US tariff announcements, noting no immediate effect on equipment, but acknowledging possible indirect macroeconomic consequences. The company has prepared multiple mitigation scenarios, including flexible global manufacturing—already expanding in Korea and establishing capability in Arizona (set to scale in 2H 2026). ASM emphasised its ability to localise production quickly if needed. While there’s been no pull-forward of tool orders due to tariff concerns, the company is monitoring the situation closely and maintaining optionality in its supply chain to navigate shifting trade conditions.

ASM International NV (ASMIY) Q1 2025 Earnings Call Transcript | Seeking Alpha

"ASM International: Upgrade To Strong Buy On Better Growth Visibility And Strength"

ASM International (ASMIY) delivered a strong Q1 FY25, exceeding expectations in revenue, margins, and orders, driven by robust AI infrastructure demand, early ramp-up of 2nm nodes, and resilient performance in China. Despite macroeconomic risks and export controls, ASM saw solid contributions from mature logic foundries and high-bandwidth memory (HBM), which relies on advanced techniques like ALD and Epi. The company’s improved operational efficiency, growing AI demand, and clearer long-term growth visibility led the author to upgrade the stock to a “strong buy,” supported by a belief that ASM can reach the high end of its FY27 revenue target with continued margin expansion.

LINK: ASM International: Upgrade To Strong Buy On Better Growth Visibility And Strength (OTCMKTS:ASMIY) | Seeking Alpha

Semiconductor Equipment Stocks: Analysis of Decline and Recovery (Feb–May 2025)

Between February and May 2025, the semiconductor equipment sector experienced significant market volatility, driven by a combination of geopolitical developments, trade policy shifts, and evolving industry dynamics. Notably, U.S. tariff announcements and uncertainty in AI infrastructure investment led to sharp downturns in stock valuations across key players such as ASML, Applied Materials, KLA, Lam Research, and ASM International. Despite the initial decline, the sector showed resilience with signs of recovery emerging in late April. Here is an overview of the key events influencing these market movements, along with insights into the partial rebound observed by early May.

📉 February 24, 2025: Tariff Concerns and AI Sector Weakness

On February 24, 2025, semiconductor equipment stocks experienced a downturn due to escalating concerns over new U.S. tariffs and a slowdown in the AI sector. President Trump's administration announced a series of tariffs that heightened trade tensions, particularly affecting technology companies with significant exposure to international markets. Additionally, the AI sector faced headwinds as companies like Super Micro Computer Inc. issued profit warnings, citing delays in AI infrastructure investments. These factors collectively contributed to a decline in investor confidence, leading to a sell-off in semiconductor-related stocks.

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📉 March 25, 2025: Temporary Relief Amid Ongoing Uncertainty

On March 25, 2025, there was a brief respite in the downward trend as President Trump announced exemptions for semiconductor equipment and other electronics from the newly imposed tariffs. This announcement provided temporary relief to the market, leading to a modest rebound in semiconductor stocks. However, the relief was short-lived as uncertainties persisted regarding the broader implications of the trade policies and their potential impact on global supply chains.

Stock Market News, March 26, 2025: Nasdaq Falls; Nvidia, Tesla Drop More Than 5%

📉 April 1, 2025: Market Crash Triggered by Sweeping Tariffs

On April 1, 2025, the semiconductor sector was significantly impacted by a broader market crash initiated by the announcement of sweeping tariffs by the U.S. administration. These tariffs affected a wide range of imports, leading to fears of a global trade war and potential recession. The semiconductor industry, being highly globalized and reliant on complex international supply chains, was particularly vulnerable. The market reacted sharply, with semiconductor equipment stocks experiencing substantial declines.

Watch Tariff-Driven Turmoil Drags Stocks to Multiyear Lows | Bloomberg: The Close 04/04/2025 - Bloomberg

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📈 Partial Recovery: Resilience Amid Challenges

Despite the challenges, semiconductor equipment stocks have shown signs of recovery in the subsequent weeks. Several factors have contributed to this partial rebound:

- Strong Earnings Reports: Companies like Cadence Design Systems reported robust earnings, indicating resilience in certain segments of the semiconductor industry.

- Continued AI Demand: The ongoing demand for AI-related technologies has provided support to the semiconductor sector, with companies like ASM International projecting sales growth driven by AI chip demand.

- Tariff Exemptions: The exemption of semiconductor equipment from certain tariffs has alleviated some immediate pressures on the industry, allowing for cautious optimism among investors.

While uncertainties remain, particularly concerning global trade policies and geopolitical tensions, the semiconductor equipment sector has demonstrated a degree of resilience, adapting to the evolving landscape and capitalizing on areas of sustained demand.

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Beneq’s Transform® ALD Tool Qualified for High-Volume GaN Power Device Production by Leading Asian Manufacturer

Beneq has announced the qualification of its Transform® ALD cluster tool for high-volume production of GaN-based power devices on 8-inch GaN-on-Si wafers by a major Tier 1 manufacturer in Asia. This achievement marks a significant step in the adoption of Beneq’s ALD technology for high-performance, scalable, and reliable GaN semiconductor applications, which are essential for power electronics and RF devices in sectors such as automotive, datacenters, and consumer electronics. The Transform system’s unique three-step process—including plasma-based surface pre-cleaning, plasma-enhanced ALD, and thermal ALD—ensures high-quality dielectric integration for wide-bandgap semiconductors like GaN and SiC.

Beneq Transform® establishes a completely new class of ALD cluster tool products in it’s versatility and adaptability to address a broad range of applications and market segments. Beneq Transform® configure with multiple ALD process modules to meet a specific wafer capacity requirement or be later upgraded in response to growing volumes or with new ALD applications. (Beneq.com)

According to Yole Intelligence, the power GaN market is set to surpass $2.2 billion by 2029, growing at a robust 41% CAGR from 2023. This tenfold expansion since 2019 is driven primarily by consumer electronics—especially fast chargers—followed by strong momentum in automotive, data center, telecom, and industrial applications. GaN's adoption is expanding into 300W mobile chargers, automotive LiDAR and onboard chargers (OBCs), high-efficiency power supplies for data centers, and future intermediate bus converters. Bidirectional GaN devices and applications in e-bikes, home appliances, and over-voltage protection (OVP) units are also contributing to market penetration.

The ecosystem is rapidly evolving, with over $4 billion invested in Power GaN since 2019 and major M&A activity including Infineon’s acquisition of GaN Systems and Renesas buying Transphorm. IDMs like STMicroelectronics, Nexperia, and Samsung are building capacity, while 8-inch GaN-on-Si is becoming standard, and early work on 12-inch is underway. Technical advances include 1200V GaN devices, bidirectional switches, and GaN-on-QST substrates. While the market is promising, failures like NexGen and BelGaN highlight the risks and capital intensity required for success​. (Yole Development)

The Beneq Transform tool's vacuum-integrated cluster design supports nitride and oxide film deposition with high throughput and competitive cost-of-ownership, making it suitable for HEMTs, integrated circuits, and vertical devices. Seventeen Transform units are now deployed globally in GaN manufacturing and R&D. The company also strengthens its GaN process innovation through its partnership with imec, where a newly installed Transform system supports ongoing research in GaN surface treatment and dielectric integration.

Key Features of the Transform GaN ALD Process

1. Three-Step ALD Process (Proprietary Architecture):

• Plasma-based surface pre-cleaning: Critical for removing contaminants and native oxides from GaN or SiC surfaces to ensure interface integrity.
• Plasma-enhanced ALD (PEALD) of interfacial layers: Enables low-temperature, conformal deposition with precise control, which is essential for GaN where thermal budgets are constrained.
• Thermal ALD of dielectric films: Offers dense and high-quality films with excellent electrical properties for gate dielectrics and passivation layers.

2. Materials Supported:

• Nitrides: AlN, SiN – important for barrier layers, passivation, or etch stops.
• Oxides: Al₂O₃, HfO₂, SiO₂ – used for gate dielectrics, field plates, and interface engineering.

Sources:

Beneq Transform® Qualified for GaN Power Device Production by Tier 1 Asian Manufacturer

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