Thursday, September 1, 2022
Supply Tightening Expected for Specialty Electronic Gases
Wednesday, August 31, 2022
Webinar Atonarp’s Aston in-situ metrology solution for Spatial ALD
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Equipment Suppliers Brace For GaN Market Explosion - including Atomic Layer Etch (ALE)
- Superior uniformity and repeatability enabled by a symmetrical chamber design, industry-leading electrostatic chuck technology, and independent process tuning features
- High productivity with low defectivity on multi-film stacks enabled by in-situ etch capability, continuous plasma, and advanced waferless auto-clean technology
- Improved critical dimension uniformity using proprietary Hydra® technology that corrects for incoming patterning variability
- Corvus® plasma sheath tuning for maximum yield of wafer-edge dies
- Atomic-scale variability control with production-worthy throughput enabled by plasma-enhanced ALE capability
- Upgradable products for low cost of ownership over several device generations
Tuesday, August 30, 2022
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies
Similarities with TSMC 7nm have been found
Monday, August 29, 2022
Materion to develop advanced chemicals for EV batteries, semiconductor chips at new facility
Sunday, August 14, 2022
ALD IGZO application for Monolithic 3D Integration
LucidaTM S Series for semiconductor is a high throughput ALD system with thermal or plasma process for 300 mm wafers and is able to deposit various oxides (HfO2, ZrO2) and metals (TiN, TaN, Ru) with excellent property and film uniformity.
Source: www.ncdtech.co.kr
Wednesday, August 3, 2022
Swagelok supports semiconductor manufacturers with new ALD valve
Sunday, July 17, 2022
Chipmetrics High Aspect Ratio Test Chip launched at ALD2022 in Ghent
At the recent AVS ALD2022 Conference in Ghent, Belgium, I made several rounds in the ALD industrial exhibition and met up with Chipmetrics Oy from Finland. Chipmetrics produce test structures, chips, and wafer concepts for advanced materials and microelectronics manufacturing, many specifically for ALD. Their main product – PillarHall test chip – is developed for advanced thin film process conformality characterization to accelerate applications of conformal 3D thin films. The Pillar Hall test chip has a lateral, very high aspect ratio structure to determine conformality when developing new ALD hardware, processes, and precursors.
Chipmetrics at AVS ALD2022 in Ghent, Belgium (Lower photo: Zahra Ghaderi, Mikko Utriainen and James Song)
What caught my eye this time was their new vertical high aspect ratio test chip - VHAR1 silicon test chip which consists of an array of vertical high aspect ratio holes. The holes have a constant hole diameter of 1 μm, and a depth of 200 μm over the whole chip area 15 × 15 mm. The deposited film penetration depth profile can be measured by cross-sectioning as normally done with the vertical high aspect ratio test structures.
This structure resembles the situation in semiconductor devices such as DRAM, 3DNAND, and TSVs. It can undoubtedly get valuable information and understanding when developing ALD processes for large surface areas with high aspect ratios. Anyone that has developed new ALD processes knows that not only the aspect ratio plays a role but also the total surface area since you need to achieve a sufficient dose of the precursors at the right process conditions to achieve perfect conformality very fast to be productive and minimize precursor decomposition, "CVD effects" and have effective purging of precursors and ALD process byproducts.
For more information, please find contact information here to Chipmetrics: LINK
Links
PillarHall – introduction in SlideShare
PillarHall – introduction in YouTube
PillarHall – short introduction in YouTube
Video: How to use PillarHall test chip
PillarHall Web Site
About Chipmetrics:
Chipmetrics is a forerunner in productizing test structures, test chips, and wafer concepts for advanced materials and microelectronics manufacturing.We are experts in thin film conformality characterization. Our main product – PillarHall test chip – is developed for advanced thin film process conformality characterization to accelerate applications of conformal 3D thin films.
Chipmetrics Oy is a part of the emerging Atomic Layer Deposition (ALD) industry and research community. Our headquarters are in Finland – in the country of the origin of ALD.
Friday, July 15, 2022
Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022
ASM International launches TENZA ALD Quad Chambers for silicon oxide gap-fill and liners on the XP8 platform
Thursday, July 14, 2022
Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem
Collaboration provides robust chemical supply chain for global chipmakers using the breakthrough technology and supports R&D for next-generation EUV applications
Tuesday, July 12, 2022
ASM Internaltional launces new 300 mm Vertical batch for LPCVD and ALD
The A412 PLUS is for 300mm wafers, while the A400 is for 200mm and smaller wafers sizes
Supply chain limited by Russia / US CHIPS Act a game changer
Monday, July 11, 2022
AlixLabs at AVS ALD ALE 2022 in Ghent, Belgium
AlixLabs AB participated and presented at The AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022) featuring the 9th International Atomic Layer Etching Workshop (ALE 2022) in Ghent, Belgium June 27 to 29.
Yoana gave her oral presentation in session LE1-TuA-4 In-situ Optical Emission Spectroscopy as a Tool to Characterize Cyclic Quasi-Atomic Layer Etching, Yoana Ilarionova, Lund University, Sweden; M. Karimi, AlixLabs, Sweden; D. Lishan, D. Geerpuram, Plasma-Therm LLC, USA; R. Jafari Jam, D. Suyatin, J. Sundqvist, AlixLabs, Sweden; I. Maximov, Lund University, Sweden
Jonas gave an invited talk for TECHCET LLC CA in: AA2-TuM2-1 High ALD Equipment and Precursor Demand and 5-Year Forecast Due to Continued Semiconductor Device Scaling and Fab Expansions.
Dmitry as part of the AVS ALE Scientific Committee moderated the session ALE1-TuA In situ Studies, Mechanisms, and Modeling of ALE. We had a fantastic time and met a lot of old friends and made new ones!
Boat trip in beautiful Ghent
AVS ALD ALE 2022 Page: ald2022.avs.org/
New world records: perovskite-on-silicon-tandem solar cells
EPFL and CSEM smash through the 30% efficiency barrier for perovskite-on-silicon-tandem solar cells —setting two certified world records
Thursday, June 30, 2022
Back to Basics: Understanding Conformality with Riikka Puurunen – ALD Stories Ep. 14
PillarHall – introduction in SlideShare
PillarHall – introduction in YouTube
PillarHall – short introduction in YouTube
Video: How to use PillarHall test chip
PillarHall Web Site