Friday, June 21, 2019

Aixtron partners in UltimateGaN project to make power semiconductors available for broad applications at competitive cost

[Semicondutor Today] Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that it is a partner in the European research project UltimateGaN (research for GaN technologies, devices and applications to address the challenges of the futureGaN roadmap). In addition to Aixtron, 25 other companies and institutions from nine countries have come together to research the next generation of energy-saving chips based on gallium nitride (GaN) over the next three years. The aim is to make these power semiconductors available for a wide range of applications at globally competitive costs.


The UltimateGaN consortium consists of 26 well-established participants originating from 9 European member states and associated countries constituting a balanced mix of industry and research with complementary skills and expertise. The multidisciplinary partners cover the entire value chain technology – packaging – reliability – application.

UltimateGaN is one of the largest existing European research projects in semiconductor development. The €48m in funding consists of investment by industry, subsidies from the individual participating countries and the Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking (JU).

Efficient use of energy for climate protection


“By developing intelligent technologies, we are making a key contribution to the global challenge of climate change,” says Aixtron president Dr Felix Grawert. “New materials and efficient chip solutions play a key role here. With this research project, we are creating the conditions for making innovative energy-saving chips available for many future-oriented everyday applications,” he adds.

“Gallium nitride semiconductor devices are revolutionizing energy use on many levels,” says professor Michael Heuken, Aixtron’s VP Research & Development. “The research project opens up an enormous global market potential,” he adds. “It enables better performance and efficiency in a wide range of applications and significantly improves user comfort. Efficient operation of servers and data centers, fast and wireless charging of smartphones, data exchange between machines in real time, or lightning-fast video streaming become reality.”
Source: Semiconductor Today LINK

Thursday, June 20, 2019

RASIRC Demonstrates Superior Titanium Dioxide Films by Use of Hydrogen Peroxide Gas

Company compares H2O2, H2O and O3 for dielectric ALD

San Diego, Calif – June 20, 2019 – RASIRC will discuss test results that compare hydrogen peroxide gas, ozone, and water mixtures for TiO2 ALD film growth during EuroCVD 22 Baltic ALD 16 conference in Luxembourg on June 24-28. The company is an exhibitor at the highly esteemed conference. RASIRC President and Founder Jeffrey Spiegelman will present a poster entitled, “Comparison of Titanium Dioxide ALD Films Grown with Hydrogen Peroxide, Ozone, or Water” during poster session 2 on the evening of June 27th. The poster will address the benefits of H2O2 for TiO2 film and reveal best process conditions for TiO2 ALD growth.

“Our research shows that H2O2 outperforms all other oxidants when growing low temperature TiO2 by ALD,” says Spiegelman. “This breakthrough provides a key solution for process engineers faced with the challenge of a low thermal budget.”

Professor Jiyoung Kim of University of Texas Dallas will also present a talk entitled, “Low temperature ALD of Silicon Nitride in Trench Structure: Comparing Hollow Cathode Plasma-Enhanced CVD and Thermal ALD with Hydrazine.” This work describes key advances for low temperature silicon nitride deposition utilizing RASIRC BRUTE® Hydrazine product.

EuroCVD 22-Baltic ALD 16 is part of the biennial series of European CVD conferences which started in Paris in 1977. It is one of the leading meetings for process and materials development in the world. The conference showcases forefront research addressing up-to-date challenges and state-of-the-art chemical processing from the gas phase (CVD, ALD, Energy-assisted CVD/ALD, MOVPE, RIE, ALE).

Spiegelman and additional RASIRC staff will be available throughout the event to discuss the RASIRC precursor chemistry product line-up, which includes the Peroxidizer®, BRUTE® Peroxide and more. Information about RASIRC products and company representatives will be available at the RASIRC exhibit located in Booth 6.

About RASIRC Products


RASIRC Peroxidizer provides high volumes of reactive H2O2/H2O mixtures for high throughput ALD. This reactive gas generator is ideal for roll-to-roll ALD coatings that require high speed deposition at reduced temperatures.

BRUTE Peroxide is a novel oxidant that improves nucleation density at film interfaces when compared to other oxidants. Surface functionalization is denser and initiation is faster using anhydrous hydrogen peroxide gas compared with alternatives. This enables better selectivity and less damage to metal surfaces in ASD processes.

BRUTE Hydrazine enables uniform nitride deposition for silicon and early transition metals at low temperature. BRUTE Hydrazine may also be used as an atomic hydrogen source, where metals such as Ru, Cu, and Co may be cleaned and reduced. Hydrazine gas is generated in situ and is virtually water free. Brute Hydrazine has been formulated for a relatively high flash point for safer handling.

Additional RASIRC products include the RainMaker® Humidification System (RHS) and the Hydrogen Peroxide Steamer (HPS). The RHS generates water vapor for oxidation applications and the HPS provides surface cleaning, preconditioning, gap fill curing, and residual carbon removal.

About RASIRC

RASIRC specializes in products that generate and deliver gas to fabrication processes. Each unit is a dynamic gas plant in a box — converting common liquid chemistries into safer and reliable gas flow for most processes. RASIRC technology delivers water vapor, hydrogen peroxide gas and hydrazine gas in controlled, repeatable concentrations. RASIRC gas delivery systems, humidifiers, and closed loop humidification systems are critical for many applications in semiconductor, photovoltaic, pharmaceutical, medical, biological, fuel cell, and power industries. Call 858-259-1220, email info@rasirc.com or visit http://www.rasirc.com.

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Contacts:

RASIRC
Jeffrey Spiegelman
Phone: 858-259-1220
E-mail: jeff@rasirc.com
 

Technical program for AVS ALD2019 and ALE2019 in Bellevue, Washington USA


Technical Program



Key Deadlines:
Hotel Reservation Deadline: June 27, 2019
JVST Special Issue Deadline: November 1, 2019

Hotel Deadline is June 27



The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). The meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.


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Logging into the app allows you to access messaging, enable the synchronization of notes, favorites, and scheduled items between devices and the online scheduler. Click Here for Download Details 



Plenary Speaker
·    Jeff Elam (Argonne National Lab, USA)
·    Eric Joseph (IBM, USA)

ALD Invited Speakers
·    Silvia Armini (IMEC, Belgium)
·    Ageeth Bol (Eindhoven Univ. of Technology, Netherlands)
·    Jolien Dendooven (Ghent Univ., Belgium)
·    Eric Dickey (Lotus Applied Technology, USA)
·    John Ekerdt (Univ.of Texas, Austin, USA)
·    Fabio Grillo (ETH Zurich, Switzerland)
·    Hyeongtag Jeon (Hanyang Univ., South Korea)
·    Jessica Kachian (Intel, USA)
·    Rajesh Krishnamurthy (TechInsights/Chipworks, Canada)
·    Alex Martinson (Argonne National Lab, USA)
·    Niloy Mukherjee (Eugenus, Inc., USA)
·    Jin-Seong Park (Hanyang Univ., South Korea)
·    Henrik Pedersen (Linkoping Univ., Sweden)
·    Madhukar Rao (Versum Materials, USA)
·    Dina Triyoso (Tokyo Electron, USA)
·    Ginger Wheeler (U.S. Naval Research Lab, USA)
ALE Invited Speakers
·    Tomoko Ito (Osaka Univ., Japan)
·    Sabbir A. Khan (Niels Bohr Institute, Univ. of Copenhagen, Denmark)
·    Nobuyuki Kuboi (Sony Semiconductor Solutions Corp., Japan)
·    Xu Li (Univ. of Glasgow, UK)
·    Alfredo Mameli (TNO-Holst Centre, The Netherlands)
·    Angelique Raley (TEL Technology Center, America, USA)
·    Kazunori Shinoda (Hitachi Ltd, Japan)
·    Samantha Tan (Lam Research, USA)

Tutorial Speakers
·    Area-selective ALD for Semiconductor Manufacturing, Stacey Bent (Stanford Univ., USA)
·    ALD for Battery Applications, Andy Sun (Western Univ., Canada)
·    ALD for Catalysis, Rong Chen (Huazhong Univ. of Science and Technology, China)
·    ALD for Photovoltaics, Bart Macco (Eindhoven Univ. of Technology, Netherlands)
·    Plasma Based ALE, Thorsten Lill, (Lam Research, USA)
·    Thermal Based ALE, Steve George (Univ. of Colorado at Boulder, USA)


ALD Program Chairs

Program Chair:
Sumit Agarwal
(Colorado School of Mines, USA)

Program Co-Chair:
Dennis Hausmann
(Lam Research, USA)
ALE Program Chairs

Program Chair:
Craig Huffman
(Micron Technology, USA)

Program Co-Chair:
Gottlieb Oehrlein
(University of Maryland, USA)