Monday, October 23, 2023
TSMC To Report Breakthrough in NMOS Nanosheets Using Ultra-Thin MoS2 Channels at IEDM 2023
Friday, October 20, 2023
The Semiconductor Showdown: TSMC's GAA FETs vs. Intel's RibbonFET
As the semiconductor race intensifies, both companies are heavily invested in outpacing each other, with TSMC focusing on technology maturity and cost-effectiveness, and Intel aiming to regain its technology leadership. The dynamics between these tech giants will shape the semiconductor industry's future.
Comparison of Advanced Semiconductor Technology Nodes: TSMC N3P & N2 vs. Intel 20A & 18A, highlighting the competitive landscape of the semiconductor industry for the years 2024-2026 based on Toms Hardware article below.
Sources:
TSMC: Our 3nm Node Comparable to Intel's 1.8nm Tech | Tom's Hardware (tomshardware.com)
Intel and TSMC company web pages
Thursday, October 19, 2023
TSMC Foresees Stabilization in PC and Smartphone Demand; Remains Optimistic Amid Semiconductor Challenges
Wednesday, September 13, 2023
Intel to Sell 10% Stake in IMS Nanofabrication to TSMC for $4.3 Billion
Wednesday, September 6, 2023
ASML Remains on Track to Deliver High NA EUV Machines in 2023
TSMC's Silicon Photonics Investment Boosts AI Chip Efficiency for ChatGPT
Thursday, August 24, 2023
TSMC Marks Major Milestone: First EUV Machine Installed in Arizona Fab, Job Opportunities Open
Taiwan Semiconductor Manufacturing Co. (TSMC) has achieved a significant milestone in its Arizona manufacturing venture by installing its inaugural extreme ultraviolet lithography (EUV) machine. This advanced machine, procured from Dutch semiconductor equipment leader ASML Holding NV, is a pivotal asset for TSMC's future high-end chip production endeavors.
EUV technology is a critical aspect of semiconductor fabrication, facilitating the printing of intricate designs on microchips significantly smaller than a human hair. TSMC's achievement underscores its commitment to innovation and technological leadership.
While the installation of the EUV machine marks a remarkable accomplishment, TSMC acknowledges that the setup of the new fab in Arizona involves numerous additional tasks. The company emphasized the need for approximately 2,000 skilled workers to handle the installation of various equipment pieces and services in the complex. This requirement stems from TSMC's unique tool configurations and specifications.
TSMC, recognized as the world's largest contract chip manufacturer, is channeling substantial investments amounting to $40 billion into constructing two wafer fabs in Phoenix. The first facility will employ the advanced 4-nanometer process, while the second, already under construction, will utilize the more sophisticated 3-nanometer process. This latter technology has already entered mass production in Taiwan.
The presence of skilled workers has been a contentious topic linked to the Arizona project. TSMC Chairman Mark Liu explained that a deficiency in experts capable of properly installing equipment at the Arizona site has led to a delay in mass production, now projected for 2025 rather than late 2024.
However, TSMC's approach to addressing this shortfall has sparked debates. The company's bid to bring in around 500 Taiwanese workers on temporary E-2 visas has faced resistance from local unions, who assert that prioritizing American jobs is paramount, especially considering the significant subsidies TSMC seeks under the CHIPS and Science Act. This legislation, signed by President Joe Biden, encourages semiconductor investments in the United States.
US Senator Mark Kelly of Arizona emphasized that the visa applications will be evaluated in accordance with established laws and procedures. As TSMC navigates these challenges, its progress in Arizona remains a focal point in the semiconductor industry's dynamic landscape.
TSMC installs first EUV machine in U.S.; job opening ads posted - Focus Taiwan
Tuesday, August 22, 2023
TSMC's 2nm Chip Plant Faces Delays in Taichung, Water and Electricity Hurdles Cited
Friday, June 30, 2023
Intel Takes Strategic Steps to Regain Semiconductor Chip Leadership
Diversifying into New Markets
Emulating the TSMC Playbook
Competing for Internal Fab Capacity
Reviving Manufacturing Prowess
Intel is expanding as a foundry in Europe
Conclusion
Sunday, September 18, 2022
Samsung to focus on treatment of gas used in chip production to achieve net-zero emissions
"Treatment of gas used to manufacture semiconductor chips is our biggest focus in our spending (to achieve net-zero emissions)," Song Doo-guen, executive vice president and head of the Environment & Safety Center at Samsung Electronics, told reporters at a briefing in Seoul.
- Samsung has pledged a 7 trillion won ($5 billion) investment to achieve its climate ambitions, and announced that it had recently joined RE100, a coalition comprising 380 global enterprises committed to becoming 100 percent renewable.
- Alongside the plan to cut direct carbon emissions, Samsung has also laid out a raft of plans to reduce indirect emissions, mainly by pursuing ultralow-power chip products.
- Other eco-conscious plans it has drawn up include capping the maximum use of freshwater to 300,000 tons a day by 2030 and eradicating gaseous and liquid pollutants by 2040 with treatment technology.
Inside TSMC, the Taiwanese chipmaking giant that’s building a new plant in Phoenix
“This project is designed as a 5 nm fab. Actually, it’s a copy from the fab we have in Taiwan,” Chen said.
We got an exclusive tour inside Taiwanese chipmaking giant TSMC's $12 billion fabrication plant outside Phoenix, Arizona. Watch the full video here: https://t.co/00keVTCxah pic.twitter.com/JV2ceg6l6v
— CNBC (@CNBC) September 17, 2022
Thursday, September 15, 2022
TSMC to double energy efficiency and clean water consumption for semiconductor wafer manufacturing
- double energy efficiency after five years of mass production for each process technology
- reduce unit water consumption (liter/12-inch equivalent wafer mask layers) by 30% (Base year: 2010)
Tuesday, August 30, 2022
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies
Similarities with TSMC 7nm have been found
Friday, January 7, 2022
TSMC Self-Aligned Via Process Development for Beyond the 3nm Node
Tuesday, May 4, 2021
CBS 60 Minutes - Chip shortage highlights U.S. dependence on fragile supply chain
- Pat Gelsinger: 25 years ago, the United States produced 37% of the world's semiconductor manufacturing in the U.S. Today, that number has declined to just 12%
- Within the world of global collaboration, there's intense competition. Days after Intel announced spending $20 billion on two new fabs, TSMC announced it would spend $100 billion over three years on R&D, upgrades, and a new fab in Phoenix, Arizona, Intel's backyard, where the Taiwanese company will produce the chips Apple needs but the Americans can't make.
Taiwan-based TSMC, which supplies microchips for most U.S. cars, tells 60 Minutes it will be caught up with car chip production by the end of June. So, does that mean the dire shortage will end in two months? Well, not quite. https://t.co/Wj1yFffaKS pic.twitter.com/Zx3dnRwU0o
— 60 Minutes (@60Minutes) May 2, 2021
Wednesday, March 24, 2021
Canon, SCREEN and Tokyo Electron to join Japan advanced chipmaking project for 2nm
Saturday, February 27, 2021
2021 ISSCC - Plenary Session with Dr. Mark Liu, TSMC Chairman
Saturday, November 28, 2020
Intel remains in the lead in 2020 semiconductor sales
Thursday, April 2, 2020
TSMC hit by 3nm delay fears over Covid-19 Lock-downs
Below a comparison of the Covid-19 daily new confirmed deaths, which is the only comparable parameter to use due to different testing capabilities and frequencies, in time and nation to nation. As can be seen the situation in Asian is under control after the gotten hit by the first wave of the Coronavirus. The European situation is stabilizing: Italy, Netherlands, Germany France, others look similar and are flattening the curve. In The USA situation is escalating. Many nations in Europe are forecasting a lift of Lockdown in May but are very careful, as an example Germany will decide in 19 April how to proceed according to Chancellor Dr. Angela Merkel.
BALD Engineering AB continues to monitor the Covid-19 situation due to lockdowns that affect the the semiconductor industry – Stay Safe!
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By Abhishekkumar Thakur, Jonas Sundqvist
Saturday, January 4, 2020
ASM International received TSMC’s Excellent Performance Award for ALD and Epitaxy products
The award was received by ASM in recognition of its technology collaboration with TSMC. During the presentation, TSMC explained three points that contributed to the award to ASM.
1) Outstanding development support.
2) Continuous efforts in productivity improvement.
3) Excellent delivery support on production ramp.
“On behalf of ASM and all of our employees, I thank TSMC for their recognition through this esteemed award,” said Chuck del Prado, CEO and President of ASM International. “Our partnership with TSMC is of strategic importance to ASM. We continuously focus on advancing our leading edge technology, including ALD and Epitaxy products and processes in support of our technology collaborations with TSMC."
ASM product portfolio for semiconducttor high volume manufacturing includes ewafer processing equipment for processes such as Atomic Layer Deposition (ALD), Plasma Enhanced ALD (PEALD), Epitaxy, Plasma Enhanced Chemical Vapor Deposition (PECVD), Low Pressure Chemical Vapor Deposition (LPCVD) and Oxidation/Diffusion. (source & credit www.asm.com)