Showing posts with label Particle ALD. Show all posts
Showing posts with label Particle ALD. Show all posts

Sunday, March 1, 2015

ALDNanoSolutions, CU-Boulder and CoorsTek to develop new additive manufacturing precursors

As reported by ALD Nano Solutions: ALD NanoSolutions continues its long standing relationship with the University of Colorado with a $90,000 grant from the Colorado Office of Economic Development and International Trade. The funding from the Advanced Industry Accelerator grant will develop direct ink writing using particle ALD core-shell precursors for net-shape additive manufacturing of advanced 3-D ceramic structures. Professor Alan Weimer at the University of Colorado is partnering with ALD NanoSolutions and CoorsTek to develop an enabling production process for the next generation of advanced 3-D ceramics for use in additive manufacturing.

ALD Nanosolutions Logo
The program will use Particle ALD(TM) to coat sintering additives directly onto fine ceramic particles and optimize the surface properties for efficient dispersion and bonding with carrier resins. This creates the optimum environment to print the highest quality 3-D ceramic parts. The precision of the Particle ALD(TM) method is leveraged to produce ideal raw materials and the scalability of the technique provides a cost effective method of production.

http://www.qmed.com/sites/default/files/imagecache/supplier_listing_logo/images/CoorsTek-485%2526K-4-inch-wide-300-dpi.jpg

About ALD NanoSolutions

As the leader in digital coating solutions for composite materials, ALD NanoSolutions (ALDN) is dedicated to bringing next generation performance to materials used across a wide range of industries. ALDN’s mission is to accelerate the commercial success of its customers by delivering superior materials solutions based on its proprietary atomic layer deposition platform. The ALDN web site is http://www.aldnanosolutions.com.

Thursday, August 7, 2014

Pulsed-bed atomic layer deposition setup for powder coating

An interesting publication on a Pulsed-bed atomic layer deposition setup for powder coating capable of conformal coatings of powders, easy technology for thickness control down to atomic level and a capability to process powders of different characteristics. Find out more in the publication bleow by H. Tizando et al from Universidad Nacional Autónoma de México.

 Pulsed-bed atomic layer deposition setup for powder coating

H. Tiznado, D. Domínguez, F. Muñoz-Muñoz, J. Romo-Herrera, R. Machorro, O.E.
Contreras, G. Soto

Abstract

Atomic layer deposition (ALD) provides a method for coating conformal, pinhole-free, chemically bonded, and ultra-thin films on particle surfaces. ALD is based on one or more cycles, each cycle comprising two half-reactions. As such, ALD is a process inherently discrete in time, where the coating thickness can be controlled as a function of number of cycles. A popular scheme for achieving uniform coats on powders is to combine ALD reactors with fluidization conditions. However, fluidization is not easy to attain because it is strongly dependent on particle size, density, morphology, and surface roughness. This article proposes that a pulsed-bed, instead of a continuous fluidization, is easier to achieve in most ALD reactors. Taking advantage of the discrete nature of the ALD process, with simple changes in the configurations of purge and carrier gases, the pulsed-bed mode can be completed. It is presented an adaptation made to a regular ALD reactor to work in this mode. The inclusion of a capsule for powder, valve relocations, and control of times were all necessary modifications. It was found that the pulsed-bed is a very convenient alternative for research purposes, since it can coat powders of different morphological characteristics, such as carbon nanotubes, flower-like ZnO micro-arrays, and YCrO3 particles.

Monday, June 16, 2014

ALD NanoSolutions is the first company to carry out ALD on particle surfaces and on polymer surfaces

Accordng to recently updated information on ALD NanoSolutions web : ALD NanoSolutions is the first company to carry out atomic layer deposition on particle surfaces and on polymer surfaces (also includes non-particle surfaces).
 
 
ALD NanoSolutions manufactures Fluidized and rotating beds ALD reactors and technology through licensing agreements: "Fluidized and rotating beds have distinct advantages with respect to ALD processing. The FBX offers the well characterized fluidized bed processing vessel; widely used, easy scaled, and excellent for thermal ALD. The RX uses a rotating bed style, which allows for easier loading and unloading, static dosing, glove box loading, and optional plasma processing. Both reactor styles are benchmark designs used for years to produce state of the art coated materials." [aldnanosolutions.com]
 
Because of this innovation, the U.S. and foreign patent offices have issued broad process and composition of matter patent claims for ALD on particles and polymers, including more than 100 related claims. ALD NanoSolutions, Inc. has exclusive rights to practice and to license the technology covered by the following patents: 

Particle Patents
Atomic Layer Controlled Deposition on Particle Surfaces – US6,613,383
Insulating and Functionalizing Fine Metal-Containing Particles with Conformal Ultra-thin Films – US6,713,177; EP1412175B7; JP4507598B; CA2452531C
Nanocoated Primary Particles and Method for their Manufacture – US6,913,827
Nanomaterials for Quantum Tunneling Varistors – US7,132,697
Dental Composite Filler Particles – US7,396,862
Titanium Dioxide Particles Coated via an Atomic Layer Deposition Process – US8,133,531

Methods for Producing Coated Phosphors and Host Material Particles Using Atomic Layer Deposition Methods – US8,163,336; US8,637,156
Metal Ferrite Spinel Energy Storage Devices and Methods for Making and Using Same – US8,187,731

Polymer Patents
Method for the Deposition of an Inorganic Film on an Organic Polymer Surface using Atomic Layer Deposition Techniques – JP4295614; CA2452656C; Pending US & EPO
Protective Coatings for Organic Electronic Devices made using Atomic Layer Deposition and Molecular Layer Deposit Techniques – JP5220106; Pending US & EPO

MEMS Patents
Atomic Layer Deposition on Micro-Mechanical Devices – US7,426,067
Al2O3 Atomic Layer Deposition to Enhanced the Deposition of Hydrophobic or Hydrophilic Coatings on Micro-Electromechanicals Devices – US7,553,686

Supporting Patents
A Solid Material Comprising a Thin Metal Film on its Surface and Methods for Producing the Same – US6,958,174
Crystal Microbalance Holder – US8,531,090