The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). The meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.
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Prof. W. M. M. (Erwin) Kessels, Eindhoven University of Technology TU/e - the ALD 2019 Innovator Awardee - The ALD Innovator award “For Original Work and Leadership in ALD” will be presented on Monday prior to the Plenary Lectures.
As announced at ALD 2018 in South Korea just recently, Prof. Sumit Agarwal (Colorado School of Mines) and Dennis Hausmann (Lam Research) will be the Chairs of the next year AVS ALD Conference July 21-24 2019 Bellevue, Washington, USA. The City of Bellevue is just across Lake Washington from Seattle. Craig Huffman (Micron) and Prof. Gottlieb Oehrlein (University of Maryland) will chair the ALE Workshop.
For those of you attending ALD2012 you may remember that the Conference was held in the Westin Bellevue.
From Twitter (LINK): Sumit Agarwal and Dennis Hausmann Chairs of #ALDep session in #ALDALE2019 announcing the next year conference. July 21-24 2019 Bellevue, Washington, USA #ALDALE2018#ALEtch