Wednesday, May 3, 2023

AVS ALD2023 & ALE2023 Late News Abstracts Due May 5 - May The 4th Be With You!




Technical Program

Late News Abstracts Due May 5



Hotel Deadline:

June 29



Early Registration:

June 1



The AVS 23rd International Conference on Atomic Layer Deposition (ALD 2023) featuring the 10th International Atomic Layer Etching Workshop (ALE 2023) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists.


The conference will take place Sunday, July 23-Wednesday, July 26, 2023, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). As in past conferences, the meeting will be preceded (Sunday, July 23) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 24-26) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Late News Abstracts

Due May 5, 2023

Presenters are limited to one oral and one poster presentation. One submission must be to an oral session and one to a poster session. It must be two different abstracts, not the same abstract submitted as both an oral and a poster.




Key Deadlines:

Late Abstract Deadline:

May 5, 2023

Early Registration Deadline: June 1, 2023

Hotel Reservation Deadline: June 29, 2023

Manuscript Deadline: November 1, 2023




ALD Plenary Speaker

Markku Leskelä

(University of Helsinki, Finland)


ALE Plenary Speaker

Tristan Tronic

(Intel, USA)



ALD Program Chairs


Program Chair:

Seán Barry

(Carleton University, Canada)


Program Co-Chair:

Scott Clendenning

(Intel, USA)

ALE Program Chairs


Program Chair:

Jane Chang

(University of California,

Los Angeles, USA)


Program Co-Chair:

Steve George

(University of Colorado at Boulder, USA)


Program Co-Chair:

Thorsten Lill

(Lam Research, USA)

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