Technical
Program
Late News
Abstracts Due May 5
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Early Registration:
June 1
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The AVS
23rd International Conference on Atomic Layer Deposition (ALD 2023) featuring
the 10th International Atomic Layer Etching Workshop (ALE
2023) will be a three-day meeting dedicated to the science
and technology of atomic layer controlled deposition of thin films
and atomic layer etching. Since 2001, the ALD conference has
been held alternately in the United States, Europe and Asia, allowing
fruitful exchange of ideas, know-how and practices between
scientists.
The conference will take place Sunday, July
23-Wednesday, July 26, 2023, at the Hyatt Regency Bellevue in
Bellevue, Washington (East Seattle). As in past conferences, the meeting will be
preceded (Sunday, July 23) by one day of tutorials
and a welcome reception. Sessions will take place (Monday-Wednesday,
July 24-26) along with an industry tradeshow. All
presentations will be audio-recorded and provided to attendees
following the conference (posters will be included as PDFs).
Anticipated attendance is 800+.
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Late News Abstracts
Due May 5, 2023
Presenters
are limited to one oral and one poster presentation. One submission
must be to an oral session and one to a poster session. It must be two
different abstracts, not the same abstract submitted as both an
oral and a poster.
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Key Deadlines:
Late Abstract Deadline:
May 5, 2023
Early Registration Deadline: June 1, 2023
Hotel Reservation Deadline: June 29, 2023
Manuscript Deadline: November 1, 2023
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ALD Plenary Speaker
Markku Leskelä
(University of Helsinki, Finland)
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ALE Plenary Speaker
Tristan Tronic
(Intel, USA)
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ALD Program Chairs
Program Chair:
Seán Barry
(Carleton University, Canada)
Program Co-Chair:
Scott Clendenning
(Intel, USA)
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ALE Program Chairs
Program Chair:
Jane Chang
(University of California,
Los Angeles, USA)
Program Co-Chair:
Steve George
(University of Colorado at Boulder, USA)
Program Co-Chair:
Thorsten Lill
(Lam Research, USA)
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