[Solid State Technology LINK]As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.
BY BARRY ARKLES, JONATHAN GOFF, Gelest Inc., Morrisville PA; ALAIN E. KALOYEROS, SUNY Polytechnic Institute, Albany, NY
Device and system technologies across several industries are on the verge of entering the sub-nanometer scale regime. This regime requires processing techniques that enable exceptional atomic level control of the thickness, uniformity, and morphology of the exceedingly thin (as thin as a few atomic layers) film structures required to form such devices and systems.
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