Monday, February 12, 2018

Gain a 'Material' Advantage - CMC Conference 2018

Gain a 'Material' Advantage
CMC Conference 2018
The 3rd Critical Materials Council (CMC) Conference is a 2-day event happening April 26-27 in Phoenix, AZ, where leading semiconductor fabs and suppliers discuss ways to resolve issues related to materials, manufacturing and global supply-chains. Speakers from CMC Members such as Intel, Samsung, and TI, along with analysts and experts from OEMs and materials-suppliers will provide presentations at this public event, which follows the private members-only CMC meeting. Benchmark your world here.

Keynote speaker David Bloss, VP of Technology and Manufacturing Group, and Director of Lithography Technology Sourcing in Global Supply Management, Intel Corp., will start the three-session event exploring:
* Updates on market dynamics and government regulations,
* Trends in the profitable control of all fab materials, and
* Technology trends & forecasts for future critical materials.

Register now for the early-bird rate of $375 by March 15th: http://cmcfabs.org/cmc-events/.
Click here for the updated agenda
CONFERENCE DETAILS

Welcome Reception April 25th evening
Sessions I & II, April 26th
Session III, April 27 morning 
Welcome reception, lunch on 26th & coffee/tea breaks are included.


The conference follows the CMC Fabs F2F meeting (on April 24-25) and CMC Members only (Associates and Fabs) Joint Session (on April 25, 2-5pm), located nearby at NXP, Chandler, AZ.  For more information about these meetings and/or the Conference, please contact Meena Sher by email by clicking here.
Early-Bird Registration by March 15
$375
Full Price $450

Saturday, February 10, 2018

NCD signed a contract to supply ALD equipment for PERC cells with JA Solar in China

NCD has recently signed a contract to supply ALD equipment for manufacturing high efficiency PERC cells with JA Solar, a large solar cell manufacturer in China. This equipment is Lucida GS Series that offers higher efficiency to crystalline silicon solar cells by depositing high quality Al2O3 ALD thin films on the back side of wafers. 
 
Lucida GS Series is a batch type ALD deposition system that forms backside passivation of Al2O3 on multiple wafers and can process more than 4.500 wafers (@ 6nm thickness) of 156mm x 156mm size per an hour. By applying Lucida GS Series in the production of solar cells, customers can dramatically lower the production cost of high efficiency solar cells due to the high-volume productivity, high yield, efficient gas consumption and low maintenance cost compared to competitors. Based on these advantages and excellence, NCD is confident that the Lucida GS Series will become essential equipment for ALD process application for manufacturing high efficiency solar cells.

NCD will continue to make efforts to become the world’s best specialized company that leads ALD technologies in the future.
< Lucida GS Series >


Spatial atomic layer deposition for coating flexible porous Li-ion battery electrodes

Here is important step forward in fast roll to roll processing of Li-battery electrodes using fast spatial ALD from CU Boulder, Colorado. Spatial ALD (SALD) is based on separating the precursors and inert gas purges in space rather than in time and therefore the deposition rates up to a hundred times faster are achievable. SALD can be performed at ambient atmosphere and therefore is a cheaper technology due to less need of expensive vacuum technology compared to conventional low pressure ALD.

High speed and low cost of ownership opens the door to high volume manufacturing of bulk quantities of energy materials for applications including solar energy, energy storage, or smart windows. Previously ALD Nanosolutions has announced a Spatial ALD technology for conformal encapsulation of ALD on powder material like for instance Li-battery cathode powder (LINK). A good overview of Spatial ALD for energy applications is this review paper by David Muñoz-Rojas et al: "Spatial Atomic Layer Deposition (SALD), an emerging tool for energy materials. Application to new-generation photovoltaic devices and transparent conductive materials" https://doi.org/10.1016/j.crhy.2017.09.004 [OPEN ACCESS]

Please find the JVSTA abstract below for the recent article form Boulder:

Thursday, February 8, 2018

Recent Solar Cell and Battery Materials Articles in JVSTA

Quite a bunch of interesting ALD papers in JVSTA!


Laser ablation compatible substoichiometric SiOx/SiNy passivating rear side mirror for passivated emitter and rear thin-film crystalline silicon solar cells,  Félix Gérenton, Fabien Mandorlo, Erwann Fourmond, Marine Le Coz, Danièle Blanc-Pélissier, Mustapha Lemiti |  Read More


Plasma-enhanced atomic layer deposition of vanadium phosphate as a lithium-ion battery electrode material,  Thomas Dobbelaere, Felix Mattelaer, Philippe M. Vereecken, Christophe Detavernier |  Read More


Performance and durability of broadband antireflection coatings for thin film CdTe solar cells,  G erald Womack, Piotr M. Kaminski, Ali Abbas, Kenan Isbilir, Ralph Gottschalg, John Michael Walls |  Read More

Application of microcracked columnar TiO2 thin films deposited by DC hollow cathode plasma jet in dye-sensitized solar cells,  Roman Perekrestov, Pavel Kudrna, Stanislav Danis, Milan Tichý, Igor Bieloshapka, Rodica Vladoiu |  Read More

Optimizing AlF3 atomic layer deposition using trimethylaluminum and TaF5: Application to high voltage Li-ion battery cathodes,   David H. K. Jackson, Masihhur R. Laskar, Shuyu Fang, Shenzhen Xu, Ryan G. Ellis, Xiaoqing Li, Mark Dreibelbis, Susan E. Babcock, Mahesh K. Mahanthappa, Dane Morgan, Robert J. Hamers, Thomas F. Kuech |  Read More

Single vacuum chamber with multiple close space sublimation sources to fabricate CdTe solar cells,  Drew E. Swanson, Jason M. Kephart, Pavel S. Kobyakov, Kevin Walters, Kevan C. Cameron, Kurt L. Barth, Walajabad S. Sampath, Jennifer Drayton, James R. Sites |  Read More

Spatial atomic layer deposition on flexible porous substrates: ZnO on anodic aluminum oxide films and Al2O3 on Li ion battery electrodes,   Kashish Sharma, Dmitri Routkevitch, Natalia Varaksa, Steven M. George |  Read More
 
Atomic layer deposition of tin oxide using tetraethyltin to produce high-capacity Li-ion batteries,  Denis V. Nazarov, Maxim Yu. Maximov, Pavel A. Novikov, Anatoly A. Popovich, Aleksey O. Silin, Vladimir M. Smirnov, Natalia P. Bobrysheva, Olga M. Osmolovskaya, and Michail G. Osmolovsky, Aleksandr M. Rumyantsev |  Read More

Atomic layer deposition of NiS and its application as cathode material in dye sensitized solar cell,   Neha Mahuli, Shaibal K. Sarkar |  Read More

Effect of the cadmium chloride treatment on RF sputtered Cd0.6Zn0.4Te films for application in multijunction solar cells,  Tushar M. Shimpi, Jason M. Kephart, Drew E. Swanson, Amit H. Munshi, Walajabad S. Sampath, A. Abbas, John M. Walls |  Read More

Wednesday, February 7, 2018

CRITICAL EVENT FOR SEMI MATERIALS - April 26-27 Phoenix

The Critical Materials Council (CMC) Conference is a 2-day event, happening April 26-27 in Phoenix, AZ, providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Speakers from CMC Members such as GlobalFoundries, Intel, Samsung, and TI, along with analysts and experts from OEMs and materials-suppliers will explore issues associated with using materials such as cobalt and ruthenium in commercial fabs. Evening receptions and lunch allow for networking time with industry leaders.

Keynote speaker David Bloss, VP of Technology and Manufacturing Group, and Director of Lithography Technology Sourcing in Global Supply Management, Intel Corp., will start the three-session event exploring:

* Updates on market dynamics and government regulations,
* Trends in the profitable control of all fab materials, and
* Technology forecasts for future critical materials.

Join us in the Phoenix area: http://cmcfabs.org/cmc-events/
 


Tuesday, February 6, 2018

ASD 2018 Call for Abstracts Deadline Extended to March 5






Call for Abstracts
Extended to March 5, 2018





The principal chemical processes and mechanisms that enable Area Selective Deposition (ASD) are rapidly becoming critical in several areas of materials and technological advancement. Most notably, the semiconductor industry will likely need new ASD processes to enable “chemical alignment” to complement traditional physical alignment (i.e. lithography) to allow transistors to scale to less than 10 nm dimensions. Other fields are also exploring chemical selectivity in materials to achieve precise targeted performance. Catalytic materials, for example, which are commonly employed to promote chemically selective reactions, are now being designed and constructed using site-selective deposition reactions. In addition, the growing complexity of energy generation and storage materials are also driving the need for new site- or area-selective processes to control heterogeneous material structures.

To share advances in these areas, the 3rd Area Selective Deposition Workshop (ASD 2018), will be held on April 29 – May 1, 2018, at North Carolina State University in Raleigh North Carolina USA. The Workshop will bring together leading international scientists and engineers from academia and industry from all regions to share results and insights into: 1) fundamental principles and barriers to area selective deposition; 2) technological needs and challenges of ASD; 3) new chemical approaches and processes to address the expanding needs; and 4) surface characterization techniques and metrology innovation for ASD.

Based on successful workshops at the Eindhoven University of Technology in 2017 and at IMEC in Leuven Belgium in 2016, ASD 2018 will consist of two days of presentations and discussions, preceded by a welcome reception at North Carolina State University on April 29. The program will include a series of invited and contributed speakers, a panel discussion, as well as a poster session reception on the evening of April 30.

Thursday, February 1, 2018

Invited speakers and tutorials for AVS ALD & ALE 2018 in Incheon Korea

The invited speakers and tutorials for AVS ALD & ALE 2018 in Incheon Korea have been announced! Please follow the link here for full details (LINK). A lot of experts from the South Korean ALD Industry and Fabs will present, including offcourse the early industry adopters (DRAM!) Samsung Electronics and SK Hynix as well as suppliers like Wonik IPS and UP Chemical and a good mix of the worlds best experts will be there as well ALD and ALE. Noting also that there will be multiple presentations from Japan for ALE like Sony (cool!), Toshiba and Tokyo Electron.

As for other years the exhibition has been sold out but sponsoring is open!

SUBMISSION for abstarcts deadline is also close - February 16, 2018 (LINK)



2nd HERALD.ECI Workshop with hands-on training for “bonding HERALD.ECIs from ideas to proposals”

Following the HERALD.ECI network kick-off : June 14, 2017 in Linköping, Sweden, and the 1st HERALD.ECI Workshop on Career Development : August 28-29, 2017 in Ghent, Belgium

The team behind HERALD ECI wisheds you alls a Warm Welcome to the 2nd HERALD.ECI Workshop with hands-on training for “bonding HERALD.ECIs from ideas to proposals” March 1-2, 2018 in Barcelona.

The 2nd HERALD.ECI Workshop is organized by:
  • Mariona Coll & Jaume Gazquez, Institut de Ciència de Materials de Barcelona;
  • Maximilian Gebhard, Ruhr-University Bochum; and
  • Marcel Junige, Technische Universität Dresden.

Just recently the Agenda was released (see below). Please visit the web page administrated by Marcel Junige for more informations : LINK

 

Picosun establishes a new business unit to ensure the best customer experience

ESPOO, Finland, 1st February, 2018 – Picosun Group, a leading supplier of advanced industrial Atomic Layer Deposition (ALD) thin film coating technology, has established a new business unit dedicated to customer experience. The goal of the new unit is to reinforce and streamline Picosun’s service and support operations even further, to ensure always the highest level customer satisfaction and maximized uptime of PICOSUN™ production ALD systems around the world.


Timo Malinen (right) - The newly appointed Customer Experience Director of the Picosun Group and the leader of the new service business unit in Helsinki and Jonas Sundqvist (left) during the making of the "Picosun - MECRALD technology by Hitachi High-Technologies and Picosun" promotion movie in Helsinki (LINK)

In the last few years, Picosun has become the ALD technology provider of choice for the world’s leading semiconductor manufacturers and various other industries. This is manifested by the impressive 68 % increase in new orders in the calendar year 2017, compared to the previous calendar year, resulting in total value of 24,4 M€ (of new orders). The demand for the company’s industrial ALD solutions is growing fast, and repeat sales of PICOSUN™ P-series high throughput batch ALD tools and PICOPLATFORM™ vacuum cluster systems underline the need for a strong, well-oiled service organization able to provide all-inclusive round-the-clock response around the globe, every day of the year.