Wednesday, August 31, 2016

RASIRC Renews Funding for Atomic Layer Deposition Research at University of California, San Diego (UCSD)

RASIRC renewed its funding agreement with the University of California, San Diego (UCSD) for on-going semiconductor processing research. Professor Andrew Kummel of the Department of Chemistry represents UCSD in this agreement. The gift donation supports one student for one year. RASIRC made a similar gift donation last year. RASIRC manufactures BRUTE® hydrogen peroxide and hydrazine vaporizers for emerging ALD applications.

San Diego, CA, August 31, 2016 (Newswire.com) - RASIRC announced today that it has renewed its funding agreement with the University of California, San Diego (UCSD) for on-going semiconductor processing research. Professor Andrew Kummel of the Department of Chemistry represents UCSD in this agreement. The gift donation supports one student for one year. RASIRC made a similar gift donation last year. RASIRC manufactures BRUTE® hydrogen peroxide and hydrazine vaporizers for emerging ALD applications. 
“Our ongoing research focuses on solving difficult materials problems associated with emerging semiconductor technology,” said Professor Kummel. “Financial and technical support from RASIRC aids our efforts to create new films and passivation layers for continuous shrinkage of semiconductor devices.”

As part of the agreement, RASIRC provides BRUTE® Peroxide and BRUTE Hydrazine materials for experimentation. The UCSD team produced and published significant findings from these materials during the previous year of research. Chemists and engineers from both organizations regularly collaborate on research and share their findings. Research covers passivation of SiGe channel materials and development of new low temperature deposition methods for metal nitrides.

“Universities play a critical role in chemical and materials research behind advances in the semiconductor industry as shown by the results produced and published by UCSD over the past year,” said  Daniel Alvarez, RASIRC Chief Technology Officer. “UCSD is a great partner and we look forward to working with the team to perfect novel new chemistries that solve very difficult problems where traditional methods do not work.”

Professor Kummel’s group is focused on understanding and imaging chemical processing at the atomic level.  Current projects include (1) In-situ cleaning and functionalization of SiGe, Ge, and InGaAs semiconductors for defect-free interfaces on FinFET sidewalls and contacts;  (2) Selective etching and ALD on semiconductors and insulators; (3) Non-Covalent Functionalization of two-dimensional semiconductors; (4) Nano-scale synthesis of silica nanoshells for tumor ultrasound imaging and ablation. Additional detail on the Kummel Research Group can be found at http://kummelgroup.ucsd.edu.

NCD to deliver Lucida GD series ALD system for OLED encapsulation with Chinese display manufacturer, TIANMA

NCD reports today (8/31 2016) :The OLED market is going to prospect fast gigantic growing in the near future because OLED has the possibilities of bending, folding and various forms like circle, therefore it will be applied for flexible and wearable devices. Flexible OLEDs need excellent thin encapsulation layers in order to keep the property from the permeation of water and oxygen under the external environment using repeated bending, folding and rolling of devices. However, the current encapsulation based on PECVD is not satisfied with future flexible OLEDs, so new encapsulation technology would absolutely be required.

Many OLED manufactures are currently reviewing to use ALD technology because of obtaining the highest property from the encapsulation layers of OLED, but they have not been solving the low throughput and particle issues followed by using their ALD systems.

In order to clear these problems, NCD has completed to develop the 6th ALD equipment for thin film encapsulation which satisfies high quality, large area and high throughput applying for the inventive ALD technology, and we have been also continuously testing customer’s samples. NCD’s ALD encapsulation layer shows much better properties than that of PECVD, and the encapsulation capability on application for foldable products has been confirmed from the customers. As a result, NCD has recently entered into the contract with Chinese display manufacturer, TIANMA to supply the 5.5th generation class ALD system of Lucida GD series for thin film encapsulation of OLED. It apparently shows that NCD’s core technologies and the result of developments have been approved by the oversea customer.

NCD will keep doing our best to set Lucida GD series as the standard of all of flexible OLED encapsulation equipment with this achievement and become the number one global ALD Company with the best competitiveness making new challenges and developments.

Lucida™ GD Series ALD


High throughput atomic layer deposition system for OLED displays 



Cluster system for Lucida™ GD series


Applications

  • Barrier layer(Al2O3, TiO2) for flexible substrate
  • WVTR(water vapor transmission rate) 5.3x10-5g/m2·day (tritiated water test @30nm Al2O3/PEN substrate)
  • Encapsulation layer(Al2O3,TiO2) for OLED
  • Applications of mass-product

Benefits

  • High throughput : > 30 panels/hour
  • Substrate size : > 6G (1500 x 1850mm2)

Features

  • Advanced process kit and small volume chamber for short gas cycle times
  • Extremely materialize ALD mechanism
  • Small foot print
  • Totally integrated process module
  • Easy process control

Technical specifications